Air Cooling Technology for Electronic Equipment: 1st Edition (Hardback) book cover

Air Cooling Technology for Electronic Equipment

1st Edition

Edited by Sung Jin Kim, Sang Woo Lee

CRC Press

272 pages

Purchasing Options:$ = USD
Hardback: 9780849394478
pub: 1996-04-26
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Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics.

Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling?

The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.

Table of Contents

Geometric Optimization of Cooling Techniques, A. Bejan


Stack of Parallel Vertical Plates Cooled by Natural Convection

Bundle of Horizontal Cylinders (Pin Fins) Cooled by Natural Convection

Stack of Parallel Plates Cooled by Laminar Forced Convection

Stack of Parallel Plates With Flush-Mounted and Protruding Heat Sources

Stack of Parallel Plates Cooled by Turbulent Forced Convection

Stack of Parallel Plates Immersed in a Free Stream

Bundle of Cylinders Cooled by Forced Convection

Heat Generating Plate Cooled Inside a Parallel Plate Channel

Stacks of Plates Shielded by Porous Screens

Plate Fins with Variable Thickness and Height

Heat Sinks with Pin Fins and Plate Fins


Entrance Design Correlations for Circuit Boards in Forced-Air Cooling, M. Faghri, M. Molki, and Y. Asako


A New Correlation for Pressure Drop

A Correlation for Heat Transfer and Wake Effect

A User-Friendly Program for Prediction of Array Temperature


Forced Air Cooling of Low-Profile Package Arrays, R.A. Wirtz


Array Geometry

Convection Processes

Estimation of Package Temperature

Determination of h (sub K) and q

Package Heat Transfer - Uniform, In-line Arrays

Coolant Pressure Drop - Uniform, In-Line Arrays

Non-Uniform Arrays


Conjugate Heat Transfer in Forced Air Cooling of Electronic Components, A. Ortega



Classification of Problems

Two Dimensional Situation: Strip Source of Heat in Boundary Layer and Channel Flow

Three Dimensional Situations: Rectangular Source of Heat


Enhanced Air Cooling of Electronic Equipment, S.V. Garimella


Enhancement Strategies

Enhancement Techniques

Performance Evaluation Criteria


Limits of Air Cooling - A Methodological Approach, K. Azar


Thermal Phenomena in Electronic Enclosures

Thermal Coupling in Electronic Enclosures

Understanding The Concept of Cooling Limit

Parameters Impacting Heat Transfer

Potential Limits of Natural and Forced Convection Cooling


Subject Categories

BISAC Subject Codes/Headings:
TECHNOLOGY & ENGINEERING / Electronics / General
TECHNOLOGY & ENGINEERING / Electronics / Microelectronics