1st Edition
Air Cooling Technology for Electronic Equipment
Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics.
Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling?
The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Introduction
Stack of Parallel Vertical Plates Cooled by Natural Convection
Bundle of Horizontal Cylinders (Pin Fins) Cooled by Natural Convection
Stack of Parallel Plates Cooled by Laminar Forced Convection
Stack of Parallel Plates With Flush-Mounted and Protruding Heat Sources
Stack of Parallel Plates Cooled by Turbulent Forced Convection
Stack of Parallel Plates Immersed in a Free Stream
Bundle of Cylinders Cooled by Forced Convection
Heat Generating Plate Cooled Inside a Parallel Plate Channel
Stacks of Plates Shielded by Porous Screens
Plate Fins with Variable Thickness and Height
Heat Sinks with Pin Fins and Plate Fins
Conclusion
Entrance Design Correlations for Circuit Boards in Forced-Air Cooling, M. Faghri, M. Molki, and Y. Asako
Introduction
A New Correlation for Pressure Drop
A Correlation for Heat Transfer and Wake Effect
A User-Friendly Program for Prediction of Array Temperature
Conclusion
Forced Air Cooling of Low-Profile Package Arrays, R.A. Wirtz
Introduction
Array Geometry
Convection Processes
Estimation of Package Temperature
Determination of h (sub K) and q
Package Heat Transfer - Uniform, In-line Arrays
Coolant Pressure Drop - Uniform, In-Line Arrays
Non-Uniform Arrays
Conclusion
Conjugate Heat Transfer in Forced Air Cooling of Electronic Components, A. Ortega
Introduction
Background
Classification of Problems
Two Dimensional Situation: Strip Source of Heat in Boundary Layer and Channel Flow
Three Dimensional Situations: Rectangular Source of Heat
Closure
Enhanced Air Cooling of Electronic Equipment, S.V. Garimella
Introduction
Enhancement Strategies
Enhancement Techniques
Performance Evaluation Criteria
Closure
Limits of Air Cooling - A Methodological Approach, K. Azar
Introduction
Thermal Phenomena in Electronic Enclosures
Thermal Coupling in Electronic Enclosures
Understanding The Concept of Cooling Limit
Parameters Impacting Heat Transfer
Potential Limits of Natural and Forced Convection Cooling
Index
Biography
Sung J. Kim and Sang W. Lee
