With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers, camcorders, watch electronics, hard-drive suspensions and a myriad of electronic equipments. Environmentally-friendly ECAs offer many advantages vis-Ã -vis solder, such as simple and low-temperature processing conditions, better thermo mechanical performance and finer pitch. This book is based on the two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to this topic. The book contains a total of 21 papers (reflecting overviews and original research) and is divided into three parts as follows: Part 1: Introduction and Recent Developments, Part 2: Mechanical, Durability and Reliability Aspects and Part 3: Characterization and Properties.
Preface Part 1: Introduction and Recent Developments Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing Directives H. J. Lewis and A. Ryan An Overview of the Use of Electrically Conductive Adhesives (ECAs) as a Solder Replacement H. J. Lewis and F. M. Coughlan Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications L. J. Matienzo, R. N. Das and F. D. Egitto Anisotropic Conductive Adhesives for Flip-Chip Interconnects W. Wang, Y. C. Chan and M. Pecht Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging M. J. Yim, Y. Li, K.-s. Moon, K. W. Paik and C. P. Wong Recent Advances in Developing High Performance Isotropic Conductive Adhesives D. D. Lu and C. P. Wong Recent Advances in Nano-conductive Adhesives D. D. Lu, Y. G. Li and C. P. Wong Part 2: Mechanical Durability and Reliability Aspects Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications Y. C. Lin and X. Chen Drop Test Performance of Isotropic Electrically Conductive Adhesives J. E. Morris and J. Lee Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects J. Haase, D. Farley, P. Iyer, P. Baumgartner, A. Dasgupta and J. F. J. Caers Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-conducting Adhesive Assemblies D. Farley, A. Dasgupta and J. F. J. Caers Fatigue Behavior of Electrically Conductive Adhesives B. Su and J. Qu Aspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive Adhesives J. Li, J. K. Lumpp, R. Andrews and D. Jacques Part 3: Characterization and Properties Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives M. Teo Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure J. Zhou and E. Sancaktar Temperature Characterization in Anisotropic Conductive Film Adhesive Bonding R. L. D. Zenner, C. T. Murray and C. Fisher Operating Temperature of Anisotropic Conducting Film Adhesives R. Divigalpitiya Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives J. Zhou and E. Sancaktar Stable and Unstable Capillary Flows of Highly-Filled Epoxy/Nickel Suspensions J. Zhou and E. Sancaktar Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles Y.-S. Lin and S.-S. Chiu Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection Y. Zhang, J. Liu, R. Larsson and I. Watanabe