Fundamentals and Applications
- Available for pre-order. Item will ship after December 10, 2020
Electrodissolution Processes: Fundamentals and Applications discusses the basic principles involved in high rate anodic dissolution processes and their application in advanced machining, micromachining, and finishing operations. The fundamental section of the book discusses the anodic dissolution behavior of different classes of metals and the influence of mass-transport, current distribution, and surface film properties on the metal removal rate and surface finishing. The application section of the book presents essential elements of electrochemical and assisted techniques for precision machining, micromachining, and polishing of advanced materials including hard to machine conducting ceramic materials.
Salient features of the book:
- A first-of-its-kind book which provides the reader with an updated scientific and engineering information related to high rate anodic dissolution processes.
- Highlights the importance of the understanding of basic principles required for designing and optimization of ECM/EMM/EP processes.
- Gives equal emphasis on the fundamentals and the applications of electrodissolution processes
- Discusses the high rate andic dissolution of two broad classes of materials namely engineering and refractory materials.
- Presents case studies to demonstrate the capabilities of different electrochemical and assisted machining, micromachining, and finishing operations.
- Presents a dedicated chapter on electrochemical planarization of copper interconnects
Table of Contents
Open Circuit Metal Dissolution Processes. Anodic Behavior of Metals. Transpassive Films and Their Breakdown Under ECM Conditions. Mass transport and Current Distribution. High Rate Anodic Dissolution of Ni, Fe, Cr, and their Alloys. High Rate Anodic Dissolution of Ti, W, and their Carbides. Anodic Dissolution of Metals in Electropolishing Electrolytes. Electrochemical Machining. Electrochemical Micromachining: Maskless Techniques. Through-Mask Electrochemical Micromachining. Electropolishing in Practice. Electrochemical Planarization of Copper Interconnects.
Dr. Madhav Datta is the Chairman of Amrita Center for Industrial Research and Innovation and a Distinguished Professor in the Department of Chemical Engineering and Materials Science, Amrita Vishwa Vidyapeetham, Coimbatore, India. Dr. Datta received his BS in Chemical Engineering from H.B. Technological Institute, Kanpur, MS in Chemical Engineering from the University of California at Los Angeles, and his doctorate from the Materials Department of Ecole Polytechnique Fédérale de Lausanne (EPFL), Switzerland. Dr. Datta's affiliations included the Materials Department of EPFL (1973-1984), IBM's T.J. Watson Research Center, Yorktown Heights, NY (1985-1999); Intel's Logic Technology Development, Portland, OR (1999-2002); and Emerson Network Power's Cooligy Precision Cooling, Mountain View, CA (2003-2013). His research interests include Electrochemical Dissolution and Deposition and their application in Microelectronic Packaging including Flip-chip Technology, Micro Cooling Devices, and Electronic Materials. For his contribution to electrochemical processing and especially to electrodissolution processes as applied to microfabrication in the electronics industry, he was awarded the Electrodeposition Research Award of the Electrochemical Society in 1998. Dr. Datta is an innovator with 49 issued US Patents and 100+ publications and is the author/editor of several books on Electrochemical Processing & Micro/Nanoelectronics. He co-edited a series on New Trends in Electrochemical Technology. He has held several administrative positions including divisional chairs in the Electrochemical Society (ECS) and the International Society of Electrochemistry (ISE). Dr. Datta chaired the Technology Working Group and Technology Implementation Group of National Electronics Manufacturing Initiative (NEMI) and developed a first of its kind technology roadmap of energy storage systems for the electronics industry.