High Temperature Electronics: 1st Edition (Hardback) book cover

High Temperature Electronics

1st Edition

By F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski

CRC Press

352 pages | 27 B/W Illus.

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Hardback: 9780849396236
pub: 1996-12-13
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Description

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them.

Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments.

High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts.

Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

Table of Contents

OVERVIEW OF HIGH TEMPERATURE ELECTRONICS

What is High Temperature Electronics?

Applications

Technical Challenges

Summary

SELECTION AND USE OF SILICON DEVICES AT HIGH TEMPERATURES

Basic Principles of Semiconductor Junctions

Silicon Bipolar Transistors

Silicon MOSFETs

Silicon-on-Insulator Technology

Metallization for High Temperature Electronics

Availability and Use of Commercial-Grade Silicon Devices in Power Converters at High Temperature

Summary

WIDE BANDGAP SEMICONDUCTORS

GaAs and Other III-V MESFET and Bipolar Devices

Heterojunction Bipolar Devices

SiC Materials and Devices

Metal Contacts on SiC

PASSIVE DEVICE SELECTION AND USE AT HIGH TEMPERATURE

Resistors

Capacitors

FIRST-LEVEL PACKAGING CONSIDERATIONS FOR THE USE OF ELECTRONIC HARDWARE AT HIGH TEMPERATURES

Wires and Wirebonds

Die Attach

Lead and Leadframe Materials

Plastic Encapsulants

Hermetic Case Materials and Lids

Lid Seals

Lead Seals

Summary

SECOND- AND THIRD-LEVEL PACKAGING CONSIDERATIONS FOR THE USE OF ELECTRONIC HARDWARE AT HIGH TEMPERATURES

Substrates

High-Temperature Solder Materials and Conductive Adhesives

Wire and Cable

Connectors

Connector Housings and Box Materials

THERMAL MANAGEMENT FOR HIGH TEMPERATURE ELECTRONICS

Thermal Management Considerations for Elevated Temperature Operation

Passive Techniques for Low (

Subject Categories

BISAC Subject Codes/Headings:
TEC008000
TECHNOLOGY & ENGINEERING / Electronics / General