This book gives a state-of-the-art overview by internationally recognized researchers of the architectures of breakthrough devices required for future intelligent integrated systems. The first section highlights Advanced Silicon-Based CMOS Technologies. New device and functional architectures are reviewed in chapters on Tunneling Field-Effect Transistors and 3-D monolithic Integration, which the alternative materials could possibly use in the future. The way we can augment silicon technologies is illustrated by the co-integration of new types of devices, such as molecular and resistive spintronics-based memories and smart sensors, using nanoscale features co-integrated with silicon CMOS or above it.
Table of Contents
Intelligent Integrated Systems Forward to Zero Variability and Zero Power! S. Deleonibus
Advanced Silicon-Based CMOS Technologies
From Planar to Trigate and Nanowires Fully Depleted Transistors, Francois Andrieu, Olivier Weber, Marie-Anne Jaud, Thomas Ernst, and Olivier Faynot
Schottky Source/Drain MOSFETs, Emmanuel Dubois, Guilhem Larrieu, Nicolas Reckinger, Xiaohui Tang, Jean-Pierre Raskin, Maud Vinet, and Louis Hutin
Advances in Silicon-On-Diamond Technology, Jean-Paul Mazellier, Julie Widiez, Marc Rabarot, François Andrieu, Samuel Saada, Mathieu Lions, Philippe Bergonzo, and Simon Deleonibus
GeOI, SiGeOI and New Devices Architectures, Cyrille Le Royer, Emmanuel Augendre, Louis Hutin, Frédéric Mayer, William Van den Daele
3D Monolithic Integration, Maud Vinet, Perrine Batude, Shashikanth Bobba
III-V Quantum-Well FETs, Suman Datta
Carbon Integrated Electronics, Hong Li, Yasin Khatami, Deblina Sarkar, Jiahao Kang, Chuan Xu, Wei Liu, and Kaustav Banerjee
New Paths to Augmented Silicon CMOS Technologies
Tunneling Field-Effect Transistors – Challenges and Perspectives, Joachim Knoch
Molecular Memories, Julien Buckley, Tiziana Pro, Venera Aiello, Micaël Charbonneau, and Barbara De Salvo
Resistive Memories, Blanka Magyari-Köpe and Yoshio Nishi
High frequency vibrating nanowire, Laurent Duraffourg and Thomas Ernst
Spintronics, Guillaume Prenat, Ursula Ebels, Gregory Di Pendina, Ricardo Sousa, and Bernard Dieny
Smart Multiphysics Sensors, Masayoshi Esashi
3D Integration and Wafer Level Packaging, Gilles Poupon
"This book gives an outstanding summary of the current state of the art for the ultimate integrated nanoelectronic device technology. Simon has pulled together a great team of leading researchers who not only describe the present but are also looking ahead on possible and probable future technology directions. The reader can enjoy an up-to-date reference list on current research in the respective fields, including new device architectures and new multifunctional solutions. Definitely on the reading recommendations for my PhD students!"
—Prof. Mikael Östling, KTH Royal Institute of Technology, Sweden
"The appearance of this book is very timely, given its comprehensive coverage of major topics in advanced CMOS technologies, as well as futuristic ‘beyond Si’ technologies. The editor is a well-recognized world leader in the field, and the authors are first-class experts who are well qualified to write their respective chapters. This book will benefit numerous students/engineers/researchers, and I plan to use it as a textbook in my advanced graduate-level class on ‘Advanced CMOS Technologies.’"
—Prof. T. P. Ma, Yale University, USA
"Nowadays, there is such a diversity in the new device technologies that even professional researchers have difficulty to catch up on them all. The publication of the book Intelligent Integrated Systems: Devices, Technologies, and Architectures is very timely, because it gives state-of-the-art information about semiconductors to engineers and students."
—Prof. Hiroshi Iwai, Tokyo Institute of Technology, Japan