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Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact, 1st Edition (Hardback) book cover

Lead-Free Soldering in Electronics

Science, Technology, and Environmental Impact, 1st Edition

By Katsuaki Suganuma

CRC Press

376 pages

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Hardback: 9780824741020
pub: 2003-12-11
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Description

Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics.

A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices!

Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses:

  • Soldering inspection and design

  • Mechanical evaluation in electronics

  • Lead-free solder paste and reflow soldering

  • Wave soldering

  • Plating lead-free soldering in electronics

    Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.

  • Reviews

    "…The authors are to be commended for the meticulous and thorough manner in which they have presented the information…of maximum value to…readers….essential"

    -Guna Selvaduray, Ph.D., San Jose State University, California, U.S.A.

    "…an excellent introduction."

    -Ken Suetsugu, Panasonic, Pioneer of Lead-Free Soldering Technology

    "There is a nice section on tin whiskers… .Yun Zhang covers the topic in relatively simple terms and describes a variety of process experiments."

    -www.leadfreesoldering.com

    Table of Contents

    Introduction to Lead-Free Soldering Technology, K. Suganuma

    Materials Science Concepts in Lead-Free Soldering, C. Handwerker, U. Kattner, and K. Moon

    Alloy Selections, K. Nimmo

    Plating Lead-Free Soldering in Electronics, H. Nawafune

    Tin Whisker Discovery and Research, Y. Zhang

    Mechanical Evaluation in Electronics, W.J. Plumbridge

    Electrochemical Migration, H. Tanaka

    Lead-Free Solder Paste and Reflow Soldering, S. Fujiuchi

    Wave Soldering, T. Nishimura

    Soldering Inspection and Design for Lead-Free Solder: Soldering Innovation by Trinity of Design,Process, and Inspection, M. Hirano

    Future of Lead-Free Soldering, K. Suganuma

    Index

    Subject Categories

    BISAC Subject Codes/Headings:
    TEC008000
    TECHNOLOGY & ENGINEERING / Electronics / General
    TEC010000
    TECHNOLOGY & ENGINEERING / Environmental / General
    TEC023000
    TECHNOLOGY & ENGINEERING / Metallurgy