Mechanical Analysis of Electronic Packaging Systems  book cover
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Mechanical Analysis of Electronic Packaging Systems





ISBN 9780367399818
Published September 5, 2019 by CRC Press
374 Pages

 
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Book Description

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Table of Contents

Analytical tools; thermal performance analysis; mechanical performance analysis; life analysis; other analysis; analysis of test data; reporting and verification.

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Author(s)

Biography

Mckeown,