3rd Edition

Practical Guide to the Packaging of Electronics Thermal and Mechanical Design and Analysis, Third Edition

By Ali Jamnia Copyright 2016
    374 Pages 122 B/W Illustrations
    by CRC Press

    376 Pages 122 B/W Illustrations
    by CRC Press

    Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems



    A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.





    Additionally, the author:









    • Addresses various cross-discipline issues in the design of electromechanical products


    • Provides a solid foundation for heat transfer, vibration, and life expectancy calculations


    • Identifies reliability issues and concerns


    • Develops the ability to conduct a more thorough analysis for the final design


    • Includes design tips and guidelines for each aspect of electronics packaging






    Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.

    Introduction
    Issues in Electronics Packaging Design
    Technical Management Issues

    Basic Heat Transfer—Conduction, Convection, and Radiation
    Basic Equations and Concepts
    General Equations
    Nondimensional Groups

    Conductive Cooling
    Introduction
    Thermal Resistance
    Heat Spreading
    Junction-to-Case Resistance
    Contact Interface Resistance
    2D or 3D Heat Conduction

    Radiation Cooling

    Introduction
    Factors Influencing Radiation
    Examples and Illustrations
    Cabinet Surface Temperature
    A Few Design Tips

    Fundamentals of Convection Cooling

    Introduction
    Free (or Natural) Convection
    Fin Design
    Forced Convection
    Indirect Flow System Design

    Combined Modes, Transient Heat Transfer, and Advanced
    Materials

    Introduction
    Total System Resistance
    Time-Dependent Temperature Variation
    Advanced Materials and Technologies

    Basics of Vibration and Its Isolation

    Introduction
    Periodic and Harmonic Motions
    Free Vibration
    Forced Vibration
    Random Vibration
    Vibrations and Mechanical Stresses Caused by Acoustics and Noise
    Multiple DOF Systems
    A Few Words on Advanced and Active Isolation Techniques

    Basics of Shock Management

    Introduction
    Pulse Shock Isolation
    Velocity Shock Isolation

    Induced Stresses

    Introduction
    Forced Vibration
    Random Vibration
    Shock Environment

    The Finite Element Methods

    Introduction
    Some Basic Definitions
    The FEA Procedure
    Finite Element Formulation
    Formulation of Characteristic Matrix and Load Vector
    Finite Element Formulation of Dynamic Problems
    Finite Element Formulation of Heat Conduction
    CAD to FEA Considerations
    Criteria for Choosing Engineering Software
    Summary

    Mechanical and Thermomechanical Concerns
    Introduction
    General Stress–Strain Relationship
    Determining Deformations under Application of General Loads
    Thermal Strains and Stresses
    Thermal Strains and Deflections
    Simplifications (or Making Engineering Assumptions)

    Acoustics
    Introduction
    Noise, Sound, and Their Difference
    Governing Equations
    Measurement and Standards
    Acoustics as a Design Priority

    Mechanical Failures and Reliability
    Introduction
    Failure Modes
    Life Expectancy
    Design Life, Reliability, and Failure Rate

    Electrical Failures and Reliability

    Introduction
    Failure Modes and Mechanism
    Life Expectancy of Electronics Assemblies
    Design Life, Reliability, and Failure Rate

    Chemical Attack Failures and Reliability Concerns

    Introduction
    Electrochemical Attacks
    Migration and Electromigration

    Reliability Models, Predictions, and Calculations

    Introduction
    Basic Definitions
    Reliability Models
    Device Failure Rate Prediction
    System Failure Rate
    Reliability Testing

    Design Considerations in an Avionics Electronic Package

    Introduction
    Design Parameters
    Analysis
    Acknowledgment

    Appendices

    References

    Biography

    Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations. Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning StationTM - used as a teaching tool for individuals with cognitive disabilities.

    "This book is intended for a hands-on engineer who needs back-of-the-envelope tools to develop design parameters and develop a means to conduct sanity checks. The true value of the book, however, is to raise the awareness of the design team on various aspects of the design that leads to developing a more reliable product."
    —James Feine, President, USI Ultrasonic, Houston, Texas, USA