Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, 3rd Edition (Hardback) book cover

Practical Guide to the Packaging of Electronics

Thermal and Mechanical Design and Analysis, Third Edition, 3rd Edition

CRC Press

342 pages | 122 B/W Illus.

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Hardback: 9781498753951
pub: 2016-07-11
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Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems

A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.

Additionally, the author:

  • Addresses various cross-discipline issues in the design of electromechanical products
  • Provides a solid foundation for heat transfer, vibration, and life expectancy calculations
  • Identifies reliability issues and concerns
  • Develops the ability to conduct a more thorough analysis for the final design
  • Includes design tips and guidelines for each aspect of electronics packaging

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.


"This book is intended for a hands-on engineer who needs back-of-the-envelope tools to develop design parameters and develop a means to conduct sanity checks. The true value of the book, however, is to raise the awareness of the design team on various aspects of the design that leads to developing a more reliable product."

—James Feine, President, USI Ultrasonic, Houston, Texas, USA

Table of Contents


Issues in Electronics Packaging Design

Technical Management Issues

Basic Heat Transfer—Conduction, Convection, and Radiation

Basic Equations and Concepts

General Equations

Nondimensional Groups

Conductive Cooling


Thermal Resistance

Heat Spreading

Junction-to-Case Resistance

Contact Interface Resistance

2D or 3D Heat Conduction

Radiation Cooling


Factors Influencing Radiation

Examples and Illustrations

Cabinet Surface Temperature

A Few Design Tips

Fundamentals of Convection Cooling


Free (or Natural) Convection

Fin Design

Forced Convection

Indirect Flow System Design

Combined Modes, Transient Heat Transfer, and Advanced



Total System Resistance

Time-Dependent Temperature Variation

Advanced Materials and Technologies

Basics of Vibration and Its Isolation


Periodic and Harmonic Motions

Free Vibration

Forced Vibration

Random Vibration

Vibrations and Mechanical Stresses Caused by Acoustics and Noise

Multiple DOF Systems

A Few Words on Advanced and Active Isolation Techniques

Basics of Shock Management


Pulse Shock Isolation

Velocity Shock Isolation

Induced Stresses


Forced Vibration

Random Vibration

Shock Environment

The Finite Element Methods


Some Basic Definitions

The FEA Procedure

Finite Element Formulation

Formulation of Characteristic Matrix and Load Vector

Finite Element Formulation of Dynamic Problems

Finite Element Formulation of Heat Conduction

CAD to FEA Considerations

Criteria for Choosing Engineering Software


Mechanical and Thermomechanical Concerns


General Stress–Strain Relationship

Determining Deformations under Application of General Loads

Thermal Strains and Stresses

Thermal Strains and Deflections

Simplifications (or Making Engineering Assumptions)



Noise, Sound, and Their Difference

Governing Equations

Measurement and Standards

Acoustics as a Design Priority

Mechanical Failures and Reliability


Failure Modes

Life Expectancy

Design Life, Reliability, and Failure Rate

Electrical Failures and Reliability


Failure Modes and Mechanism

Life Expectancy of Electronics Assemblies

Design Life, Reliability, and Failure Rate

Chemical Attack Failures and Reliability Concerns


Electrochemical Attacks

Migration and Electromigration

Reliability Models, Predictions, and Calculations


Basic Definitions

Reliability Models

Device Failure Rate Prediction

System Failure Rate

Reliability Testing

Design Considerations in an Avionics Electronic Package


Design Parameters





About the Originator


Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations.Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning StationTM - used as a teaching tool for individuals with cognitive disabilities.

Subject Categories

BISAC Subject Codes/Headings:
TECHNOLOGY & ENGINEERING / Electronics / General
TECHNOLOGY & ENGINEERING / Electronics / Microelectronics