3rd Edition

Practical Guide to the Packaging of Electronics
Thermal and Mechanical Design and Analysis, Third Edition




ISBN 9781498753951
Published July 11, 2016 by CRC Press
342 Pages 122 B/W Illustrations

USD $175.00

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Book Description

Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems

A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.

Additionally, the author:

  • Addresses various cross-discipline issues in the design of electromechanical products
  • Provides a solid foundation for heat transfer, vibration, and life expectancy calculations
  • Identifies reliability issues and concerns
  • Develops the ability to conduct a more thorough analysis for the final design
  • Includes design tips and guidelines for each aspect of electronics packaging

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.

Table of Contents

Introduction
Issues in Electronics Packaging Design
Technical Management Issues

Basic Heat Transfer—Conduction, Convection, and Radiation
Basic Equations and Concepts
General Equations
Nondimensional Groups

Conductive Cooling
Introduction
Thermal Resistance
Heat Spreading
Junction-to-Case Resistance
Contact Interface Resistance
2D or 3D Heat Conduction

Radiation Cooling

Introduction
Factors Influencing Radiation
Examples and Illustrations
Cabinet Surface Temperature
A Few Design Tips

Fundamentals of Convection Cooling

Introduction
Free (or Natural) Convection
Fin Design
Forced Convection
Indirect Flow System Design

Combined Modes, Transient Heat Transfer, and Advanced
Materials

Introduction
Total System Resistance
Time-Dependent Temperature Variation
Advanced Materials and Technologies

Basics of Vibration and Its Isolation

Introduction
Periodic and Harmonic Motions
Free Vibration
Forced Vibration
Random Vibration
Vibrations and Mechanical Stresses Caused by Acoustics and Noise
Multiple DOF Systems
A Few Words on Advanced and Active Isolation Techniques

Basics of Shock Management

Introduction
Pulse Shock Isolation
Velocity Shock Isolation

Induced Stresses

Introduction
Forced Vibration
Random Vibration
Shock Environment

The Finite Element Methods

Introduction
Some Basic Definitions
The FEA Procedure
Finite Element Formulation
Formulation of Characteristic Matrix and Load Vector
Finite Element Formulation of Dynamic Problems
Finite Element Formulation of Heat Conduction
CAD to FEA Considerations
Criteria for Choosing Engineering Software
Summary

Mechanical and Thermomechanical Concerns
Introduction
General Stress–Strain Relationship
Determining Deformations under Application of General Loads
Thermal Strains and Stresses
Thermal Strains and Deflections
Simplifications (or Making Engineering Assumptions)

Acoustics
Introduction
Noise, Sound, and Their Difference
Governing Equations
Measurement and Standards
Acoustics as a Design Priority

Mechanical Failures and Reliability
Introduction
Failure Modes
Life Expectancy
Design Life, Reliability, and Failure Rate

Electrical Failures and Reliability

Introduction
Failure Modes and Mechanism
Life Expectancy of Electronics Assemblies
Design Life, Reliability, and Failure Rate

Chemical Attack Failures and Reliability Concerns

Introduction
Electrochemical Attacks
Migration and Electromigration

Reliability Models, Predictions, and Calculations

Introduction
Basic Definitions
Reliability Models
Device Failure Rate Prediction
System Failure Rate
Reliability Testing

Design Considerations in an Avionics Electronic Package

Introduction
Design Parameters
Analysis
Acknowledgment

Appendices

References

...
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Author(s)

Biography

Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations. Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning StationTM - used as a teaching tool for individuals with cognitive disabilities.

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Author - Ali  Jamnia
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Ali Jamnia

Sr. Technical Manager, Baxter Healthcare
Pleasant Prairie, WI, USA

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Reviews

"This book is intended for a hands-on engineer who needs back-of-the-envelope tools to develop design parameters and develop a means to conduct sanity checks. The true value of the book, however, is to raise the awareness of the design team on various aspects of the design that leads to developing a more reliable product."
—James Feine, President, USI Ultrasonic, Houston, Texas, USA