Self-Organized 3D Integrated Optical Interconnects : with All-Photolithographic Heterogeneous Integration book cover
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Self-Organized 3D Integrated Optical Interconnects
with All-Photolithographic Heterogeneous Integration




  • Available for pre-order. Item will ship after March 9, 2021
ISBN 9789814877046
March 9, 2021 Forthcoming by Jenny Stanford Publishing
380 Pages 28 Color & 244 B/W Illustrations

 
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Book Description

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.

This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.

Table of Contents

1. Introduction  2. Guidelines toward Self-Organized 3D Integrated Optical Interconnects  3. Scalable Film Optical Link Modules (S-FOLMs)  4. Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits  5. Resource Saving All-Photolithographic Heterogeneous Integration: PL-Pack with SORT  6. High-Speed/Small-Size Light Modulators and Optical Switches  7. Self-Organized Lightwave Networks (SOLNETs)  8. Self-Organized 3D Integrated Optical Interconnects: Model Proposals  9. Self-Organized 3D Micro Optical Switching Systems (3D-MOSS): Model Proposals and Predicted Performance  10. Film-Based Integrated Solar Energy Conversion Systems 11. Embodiments Disclosed in Patents  12. Future Challenges

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Author(s)

Biography

Tetsuzo Yoshimura is currently a professor emeritus at Tokyo University of Technology.