Semiconductor Packaging: Materials Interaction and Reliability, 1st Edition (e-Book) book cover

Semiconductor Packaging

Materials Interaction and Reliability, 1st Edition

By Andrea Chen

CRC Press

216 pages

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Description

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The boo

Table of Contents

SEMICONDUCTOR PACKAGES: History and Background. Package Form Factors and Families. Surface-Mount Technology. Other Packaging Needs. PACKAGE RELIABILITY: Reliability Testing. MATERIALS USED IN SEMICONDUCTOR PACKAGING: Polymers. Metals. Ceramics and Glasses. THE FUTURE: Trends and Challenges. Light-Emitting Diodes. Appendices. Index.

About the Author

Andrea Chen is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthored more than 30 papers and presentations.

Randy Hsiao-Yu Lo is president of Siliconware USA, Inc. He was previously the vice president of R&D at SPIL, leader of the Electronic Packaging Development group at ERSO/ITRI-Taiwan, and senior engineering manager of the Package Technology group at National Semiconductor Corporation. He has coauthored more than 20 papers and presentations and holds over 40 U.S. patents.

Subject Categories

BISAC Subject Codes/Headings:
TEC008000
TECHNOLOGY & ENGINEERING / Electronics / General
TEC008010
TECHNOLOGY & ENGINEERING / Electronics / Circuits / General
TEC021000
TECHNOLOGY & ENGINEERING / Material Science