Katsuyuki  Sakuma Author of Evaluating Organization Development
FEATURED AUTHOR

Katsuyuki Sakuma

Research Staff Member
IBM T.J. Watson Research Center

Katsuyuki Sakuma is a research staff member at the IBM T. J. Watson Research Center. He is also a Visiting Professor at the Department of Biomedical Engineering, Tohoku University, Japan. His research interests include 3D integration technologies, bonding technologies, and advanced packaging.

Biography

Katsuyuki Sakuma is a research staff member at the IBM T. J. Watson Research Center. He is also a Visiting Professor at the Department of Biomedical Engineering, Tohoku University, Japan. His research interests include 3D integration technologies, bonding technologies, and advanced packaging.

He has published more than 85 peer-reviewed journal papers and conference proceeding papers, including three book chapters. He has also been the lead author of work at the Electronics Components and Technology Conference (ECTC) (2007-2016). He also holds 40 issued or pending U.S. and international patents. He has been recognized with the IBM Eleventh Invention Achievement Award in 2017 and an Outstanding Technical Achievement Award (OTAA) in 2015. He was also given the 2018 Exceptional Technical Achievement Award from IEEE Electronics Packaging Society and the 2017 Alumni Achievement Award from his Alma Mater, the School of Engineering at Tohoku University, for his exceptional contribution to 3D chip stack technology development in the global microelectronics packaging industry. He was co-recipient of IEEE CPMT Japan Society Best Presentation Award in 2012, and the IMAPS Best Paper Award of the interactive poster session in 2015.

He received his B.S. and M.S. degrees from Tohoku University, respectively, and the Ph.D. degree from Waseda University, Japan. He has been a senior member of IEEE and a member of the Japan Society of Applied Physics (JSAP). He has served as a committee member of the IEEE ECTC sub-committee since 2012, for the IEEE 3DIC technical program committee since 2016, and for the IEEE IRPS since 2017.

Websites

Books

Featured Title
 Featured Title - 3D Integration in VLSI Circuits - 1st Edition book cover

Photos

News

Fingernail Sensors and AI Can Help Clinicians to Monitor Health and Disease Progression

By: Katsuyuki Sakuma
Subjects: Biomedical Science, Engineering - Electrical, Healthcare, Life Science

Grip strength is a useful metric in a surprisingly broad set of health issues. It has been associated with the effectiveness of medication in individuals with Parkinson’s disease, the degree of cognitive function in schizophrenics, the state of an individual’s cardiovascular health, and all-cause mortality in geriatrics. At IBM Research, one of our ongoing challenges is to obtain a better understanding of the effects of diseases on an individual’s overall health, as well as how AI can help clinicians to monitor individuals in their natural environments, and potentially point to indicators and clues into the progression of a patient’s conditions. In new research published in Scientific Reports, our team details a first-of-a-kind “fingernail sensor” prototype to help monitor human health. The wearable, wireless device continuously measures how a person’s fingernail bends and moves, which is a key indicator of grip strength.