2nd Edition

Integrated Circuit Quality and Reliability

By Eugene R. Hnatek Copyright 1995

    Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

    Preface
    Overview of Integrated Circuit Quality and Trends
    Historical Perspective on IC Quality
    Trends
    References

    Introduction to Integrated Circuit Manufacturing Processes
    Front-End IC Fabrication Operations
    Basic IC Materials
    IC Design
    Mask Making
    IC Fabrication Sequence
    Depositing Layers on the Water Surface
    Chemical Vapor Deposition
    Evaporation
    Sputtering
    Die Passivation
    Typical IC Processes
    References
    Back-End Fabrication Operations
    Water Probe Test
    New Water Probe Methods
    Scribe and Break
    Assembling and Packaging the IC
    Electrical Testing
    Yield Considerations
    References
    Selected Readings
    In-Line Process Monitors and Test Structures
    References

    Impact of New Technologies
    Circuit Design Trends
    What the DRAM Future Promises
    Vertical Structures
    Three-Dimensional ICs
    Logic Stimulations
    References
    Changing Fabrication Techniques
    Lithography
    Doping Trends- Changes in Diffusions Furnace Usage
    Ion Implantation
    Material Technology Trends
    VLSI Metallization
    Summary
    References
    Selected Readings
    Packaging Technology Trends
    New Package Solutions
    Multichip Module Packages
    Die Interconnection Techniques
    References
    Selected Readings
    Electrical Testing of VSICs and ASICs
    Introduction
    The Purpose of Testing
    Historical SSI and MSI Test Program Development Methodology
    The Nature if VLSI Circuits as It Impacts Testing
    Testing VLSIC Devices
    Test Philosophy
    Systems of Silicon
    The Designer( User) Foundry (Supplier) Interface
    Test Specifications
    Integrating Designs and Test
    The Simulator- Tester Relationship
    Test Generation and Fault Simulation
    Other Methods of Applying Simulation to Test
    Testability
    Design-for-Test
    Engineering Workstations
    ATE Software Verification
    Conclusion
    References
    Selected Reading

    Contamination and Manufacturing Errors
    References
    Contamination
    Water Ecology
    Sources of Contamination
    References
    Human-Derived Contamination
    Human Traffic
    Human Dust
    Protective Garments
    References
    IC Processing Contamination
    Photomasking and Photoresist Defects
    Etch
    Dry Processing
    High-Temperature Processes
    Ion Implantation
    Equipment Contamination
    Wafer Processing Automation
    Electrostatic Charge
    Equipment Considerations that Could Produce Errors at Wafer Probe
    Contamination During Bonding and Packaging Operations
    References
    Selected Readings
    Contamination Control
    References
    Computer-Based Sources of Error in Design and Test
    Circuit Design Overview
    Sources of Error
    References
    Materials Issues
    Introduction
    IC Material Properties
    Degradation
    Dislocations
    Mechanical Defects
    Stress Concentrators
    Dielectric Layers
    Metallization
    Package and Interconnection Issues
    References

    Causes (Sources) of IC Failures
    Fabrication-Related Causes of IC Defects
    Bulk and Surface Failures
    Processing Faults
    Dielectric Breakdown
    Ionic Contamination
    Hot Carrier Effects
    Metallization
    Summary of VLSI Circuit Defects nd Failure Mechanisms
    References
    Selected Readings
    Packaging- and Assembly-Related Causes of IC Failures
    Overview
    Surface Passivation and Corrosion
    Electromagnetic Migration
    Die Bonding Issues
    The Physical Package
    Hermetic Package Reliability
    Plastic Package Reliability
    External Package Moisture-Induced Failure Mechanisms
    Human Causes of Error
    Summary
    References
    Reliability Improvement
    Overview
    The Bathtub Failure curve
    The Arrhenius Equation and Temperature Acceleration
    Activation Energy
    Problems Encountered in Applying the Arrhenius Equation
    References

    Introduction to Screening
    Screening
    Introduction
    ESS Overview
    Most Commonly Employed Screens
    Conventional Screening Procedures
    Screening Sequence
    Selected Stress Screen Discussion
    Monitoring the Screening Program
    Appendix – Periodic Table of Elements
    Indexz

    Biography

    Hnatek, Eugene R.

    "The new edition brings the baseline IC technology and tool set up to date. . ..it covers all the material in more depth than the first edition. . .. . . .a good tutorial on IC fabrication and packaging, including quality concerns. . .. Excellent chapters on design, fabrication, packaging, and test put today's engineer in a good position to understand the impact of contamination and manufacturing errors on their IC products. "
    ---IEEE Components, Packaging, and Manufacturing Technology Society Newsletter