Electronic Packaging Products

  • Microlithography

    Science and Technology, Third Edition, 3rd Edition

    Edited by Bruce W. Smith, Kazuaki Suzuki

    This new edition of the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from elementary concepts to advanced aspects of modern submicron microlithography. Each chapter reflects the current research and practices from…

    Hardback – 2020-04-01 
    CRC Press

  • Phase Change Material-Based Heat Sinks

    A Multi-Objective Perspective, 1st Edition

    By Srikanth Rangarajan, C. Balaji

    Phase-change Material based heat sinks and associated optimization remains a topic of great interest, as evident from the increasing number of citations and new applications and miniaturization. Often the multi objective perspective of such heat sinks is ignored. This book introduces the readers to…

    Hardback – 2019-12-04 
    CRC Press

  • Electronic Circuit Design

    From Concept to Implementation, 1st Edition

    By Nihal Kularatna

    With growing consumer demand for portability and miniaturization in electronics, design engineers must concentrate on many additional aspects in their core design. The plethora of components that must be considered requires that engineers have a concise understanding of each aspect of the design…

    Paperback – 2019-09-19
    CRC Press

  • MicroMechatronics, Second Edition

    2nd Edition

    By Kenji Uchino

    After Uchino’s introduction of a new terminology, ‘Micromechatronics’ in 1979 for describing the application area of ‘piezoelectric actuators’, the rapid advances in semiconductor chip technology have led to a new terminology MEMS(micro-electro-mechanical-system) or even NEMS (…

    Hardback – 2019-08-02
    CRC Press

  • Introduction to Microsystem Packaging Technology

    1st Edition

    By Yufeng Jin, Zhiping Wang, Jing Chen

    The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in…

    Paperback – 2018-09-10
    CRC Press

  • Long-Term Non-Operating Reliability of Electronic Products

    1st Edition

    By Judy Pecht

    In today's electronic environment, operating reliability for continued daily use of electronic products is essential. This book discusses the reliability of products that lie dormant for long periods of time and are subject to stresses such as humidity, ionic contaminants, temperature, radiation,…

    Hardback – 2017-12-13
    CRC Press

  • Semiconductor Packaging

    Materials Interaction and Reliability, 1st Edition

    By Andrea Chen, Randy Hsiao-Yu Lo

    In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the…

    Paperback – 2017-04-10
    CRC Press

  • Extreme Environment Electronics

    1st Edition

    Edited by John D. Cressler, H. Alan Mantooth

    Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing…

    Paperback – 2017-04-06
    CRC Press
    Industrial Electronics

  • Embedded and Networking Systems

    Design, Software, and Implementation, 1st Edition

    Edited by Gul N. Khan, Krzysztof Iniewski

    Embedded and Networking Systems: Design, Software, and Implementation explores issues related to the design and synthesis of high-performance embedded computer systems and networks. The emphasis is on the fundamental concepts and analytical techniques that are applicable to a range of embedded and…

    Paperback – 2017-03-29
    Chapman and Hall/CRC
    Devices, Circuits, and Systems

  • Novel Advances in Microsystems Technologies and Their Applications

    1st Edition

    Edited by Laurent A. Francis, Krzysztof Iniewski

    Microsystems technologies have found their way into an impressive variety of applications, from mobile phones, computers, and displays to smart grids, electric cars, and space shuttles. This multidisciplinary field of research extends the current capabilities of standard integrated circuits in…

    Paperback – 2017-03-29
    CRC Press
    Devices, Circuits, and Systems

  • Practical Guide to the Packaging of Electronics

    Thermal and Mechanical Design and Analysis, Third Edition, 3rd Edition

    Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an…

    Hardback – 2016-07-11
    CRC Press

  • Cyber-Physical Systems

    From Theory to Practice, 1st Edition

    Edited by Danda B. Rawat, Joel J.P.C. Rodrigues, Ivan Stojmenovic

    Although comprehensive knowledge of cyber-physical systems (CPS) is becoming a must for researchers, practitioners, system designers, policy makers, system managers, and administrators, there has been a need for a comprehensive and up-to-date source of research and information on cyber-physical…

    Hardback – 2015-10-22
    CRC Press

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