3D Integration for VLSI Systems  book cover
1st Edition

3D Integration for VLSI Systems

ISBN 9789814303811
Published September 26, 2011 by Jenny Stanford Publishing
378 Pages 162 Color & 83 B/W Illustrations

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Book Description

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.

There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.

Table of Contents

3D Integration Technology – Introduction and Overview
Chuan Seng Tan, Kuan-Neng Chen and Steven J. Koester
A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For?
Phil Emma and Eren Kursun
Wafer Bonding Techniques
Bioh Kim, Thorsten Matthias, Viorel Dragoi, Markus Wimplinger and Paul Lindner
TSV Etching
Paul Werbaneth
TSV Filling
Arthur Keigler
3D Technology Platform: Temporary Bonding and Release
Mark Privett
3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling
Scott Sullivan
Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology
Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
Advanced Direct Bond Technology
Paul Enquist
Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration
Akitsu Shigetou
Through Silicon Via Implementation in CMOS Image Sensor Product
Xavier Gagnard and Nicolas Hotellier
A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through- Silicon Via and Hybrid Cu-Adhesive Bonding
Fei Liu
Power Delivery in 3D IC Technology with a Stratum Having an Array of Monolithic DC-DC Point-of-Load (PoL) Converter Cells
Ron Rutman and Jian Sun
Thermal-Aware 3D IC Designs
Xiaoxia Wu, Yuan Xie and Vijaykirshnan Narayanan
3D IC Design Automation Considering Dynamic Power and Thermal Integrity
Hao Yu and Xiwei Huang
Ya Lan

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"3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology."
—Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA