3D Integration for VLSI Systems: 1st Edition (Hardback) book cover

3D Integration for VLSI Systems

1st Edition

Edited by Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester

Jenny Stanford Publishing

350 pages | 162 Color Illus. | 83 B/W Illus.

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Hardback: 9789814303811
pub: 2011-09-26
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Description

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.

There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.

Reviews

"3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology."

—Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA

Table of Contents

3D Integration Technology – Introduction and Overview

Chuan Seng Tan, Kuan-Neng Chen and Steven J. Koester

A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For?

Phil Emma and Eren Kursun

Wafer Bonding Techniques

Bioh Kim, Thorsten Matthias, Viorel Dragoi, Markus Wimplinger and Paul Lindner

TSV Etching

Paul Werbaneth

TSV Filling

Arthur Keigler

3D Technology Platform: Temporary Bonding and Release

Mark Privett

3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling

Scott Sullivan

Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology

Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka and Mitsumasa Koyanagi

Advanced Direct Bond Technology

Paul Enquist

Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration

Akitsu Shigetou

Through Silicon Via Implementation in CMOS Image Sensor Product

Xavier Gagnard and Nicolas Hotellier

A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through- Silicon Via and Hybrid Cu-Adhesive Bonding

Fei Liu

Power Delivery in 3D IC Technology with a Stratum Having an Array of Monolithic DC-DC Point-of-Load (PoL) Converter Cells

Ron Rutman and Jian Sun

Thermal-Aware 3D IC Designs

Xiaoxia Wu, Yuan Xie and Vijaykirshnan Narayanan

3D IC Design Automation Considering Dynamic Power and Thermal Integrity

Hao Yu and Xiwei Huang

Outlook

Ya Lan

Subject Categories

BISAC Subject Codes/Headings:
SCI055000
SCIENCE / Physics
TEC008070
TECHNOLOGY & ENGINEERING / Electronics / Microelectronics
TEC021000
TECHNOLOGY & ENGINEERING / Material Science