378 Pages 162 Color & 83 B/W Illustrations
    by Jenny Stanford Publishing

    Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.

    There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.

    3D Integration Technology – Introduction and Overview
    Chuan Seng Tan, Kuan-Neng Chen and Steven J. Koester
    A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For?
    Phil Emma and Eren Kursun
    Wafer Bonding Techniques
    Bioh Kim, Thorsten Matthias, Viorel Dragoi, Markus Wimplinger and Paul Lindner
    TSV Etching
    Paul Werbaneth
    TSV Filling
    Arthur Keigler
    3D Technology Platform: Temporary Bonding and Release
    Mark Privett
    3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling
    Scott Sullivan
    Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology
    Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
    Advanced Direct Bond Technology
    Paul Enquist
    Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration
    Akitsu Shigetou
    Through Silicon Via Implementation in CMOS Image Sensor Product
    Xavier Gagnard and Nicolas Hotellier
    A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through- Silicon Via and Hybrid Cu-Adhesive Bonding
    Fei Liu
    Power Delivery in 3D IC Technology with a Stratum Having an Array of Monolithic DC-DC Point-of-Load (PoL) Converter Cells
    Ron Rutman and Jian Sun
    Thermal-Aware 3D IC Designs
    Xiaoxia Wu, Yuan Xie and Vijaykirshnan Narayanan
    3D IC Design Automation Considering Dynamic Power and Thermal Integrity
    Hao Yu and Xiwei Huang
    Ya Lan


    Chuan Seng Tan, Kuan-Neng Chen

    "3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology."
    —Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA