Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe.
"With the increasing cost and power issues associated with continuing along the traditional road of 2D scaling, 3D integration is becoming an essential enabler for performance gains in future VLSI nodes. This book provides an insightful treatment of the challenges and opportunities for intelligently evolving 3D integration into volume manufacturing and the applications that will exploit this exciting technology."
—David Danovitch, Université de Sherbrooke, Canada
"The chapter authors are the world’s leading scientists and experts in this field and they cover the state-of-the-art topics that the readers really want."
— James J.-Q. Lu, Rensselaer Polytechnic Institute, USA
1. Three-Dimensional Integration: Technology and Design
2. Three-Dimensional System-in-Package for Application-Specific Integrated Circuit and Three-Dimensional Dynamic Random-Access Memory Integration
3. A New Class of High-Capacity, Resource-Rich Field-Programmable Gate Arrays Enabled by
Three- Dimensional Integration Chip-Stacked Silicon Interconnect Technology
Suresh Ramalingam, Henley Liu, Myongseob Kim, Boon Ang, Woon-Seong Kwon, Tom Lee, Susan Wu, Jonathan Chang, Ephrem Wu, Xin Wu, and Liam Madden
4. Challenges in 3D Integration
M. Koyanagi, T. Fukushima, and T. Tanaka
5. Wafer-Level Three-Dimensional Integration Using Bumpless Interconnects and Ultrathinning
6. Three-Dimensional Integration Stacking Technologies for High-Volume Manufacturing by Use of Wafer-Level Oxide-Bonding Integration
Spyridon Skordas, Katsuyuki Sakuma, Kevin Winstel, and Chandrasekharan Kothandaraman
7. Toward Three-Dimensional High Density
S. Cheramy, A. Jouve, C. Fenouillet-Beranger, P. Vivet, and L. Di Cioccio
8. Novel Platforms and Applications Using Three-Dimensional and Heterogeneous Integration Technologies
Kuan-Neng Chen, Ting-Yang Yu, Yu-Chen Hu, and Cheng-Hsien Lu