1st Edition
Advancements in AI and IoT for Chip Manufacturing and Defect Prevention
1. INTRODUCTION
2. EXPLORING EMERGING TRENDS IN SEMICONDUCTOR MANUFACTURING
3. OVERVIEW OF SEMICONDUCTOR MANUFACTURING
4. INLINE PARAMETERS IN SEMICONDUCTOR MANUFACTURING
5. ELECTRICAL TESTING IN WAFER, DIE
6. INTRODUCTION TO PROCESS OPTIMIZATION IN SEMICONDUCTOR MANUFACTURING PROCESSES
7. OVERVIEW OF AI AND APPLICATIONS IN SEMICONDUCTOR MANUFACTURING
8. OVERVIEW OF IOT TECHNOLOGIES AND APPLICATIONS
9. FUNDAMENTALS OF SEMICONDUCTOR DEFECTS
BIBLIOGRAPHY
INDEX
Biography
Rupal Jain is a distinguished figure in the field of semiconductor chip manufacturing, with extensive expertise in engineering, program management, and strategic alignment. Throughout her career, she has spearheaded projects encompassing the entire chip development lifecycle – from design conception and quality management to global delivery across regions like the USA, Taiwan, Singapore, Italy, Malaysia, China, and India. Her profound knowledge is recognized by prestigious certifications like PMP, CSM, and Lean Six Sigma Black Belt. Rupal holds a master’s degree in electrical and Electronics Engineering, earned through a joint program between NTU Singapore and TUM Germany. Beyond her technical prowess, Rupal's innovative contributions have garnered international acclaim. She is a frequent contributor to esteemed publications, serves on prestigious juries, and holds nominated memberships in industry organizations. Notably, her work has been recognized with coveted awards and patents, further solidifying her position as a leader in the field. Her other authored pieces- ""Mastering Project Management: PMP and Agile for Leaders"" and ""Semiconductor Essentials : A Leader's Express reference to Electronics Concepts"" promise to share her valuable insights with the next generation of leaders and engineers.
