1st Edition

Air Cooling Technology for Electronic Equipment

Edited By Sung Jin Kim, Sang Woo Lee Copyright 1996

    Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics.

    Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling?

    The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.

    Geometric Optimization of Cooling Techniques, A. Bejan
    Stack of Parallel Vertical Plates Cooled by Natural Convection
    Bundle of Horizontal Cylinders (Pin Fins) Cooled by Natural Convection
    Stack of Parallel Plates Cooled by Laminar Forced Convection
    Stack of Parallel Plates With Flush-Mounted and Protruding Heat Sources
    Stack of Parallel Plates Cooled by Turbulent Forced Convection
    Stack of Parallel Plates Immersed in a Free Stream
    Bundle of Cylinders Cooled by Forced Convection
    Heat Generating Plate Cooled Inside a Parallel Plate Channel
    Stacks of Plates Shielded by Porous Screens
    Plate Fins with Variable Thickness and Height
    Heat Sinks with Pin Fins and Plate Fins
    Entrance Design Correlations for Circuit Boards in Forced-Air Cooling, M. Faghri, M. Molki, and Y. Asako
    A New Correlation for Pressure Drop
    A Correlation for Heat Transfer and Wake Effect
    A User-Friendly Program for Prediction of Array Temperature
    Forced Air Cooling of Low-Profile Package Arrays, R.A. Wirtz
    Array Geometry
    Convection Processes
    Estimation of Package Temperature
    Determination of h (sub K) and q
    Package Heat Transfer - Uniform, In-line Arrays
    Coolant Pressure Drop - Uniform, In-Line Arrays
    Non-Uniform Arrays
    Conjugate Heat Transfer in Forced Air Cooling of Electronic Components, A. Ortega
    Classification of Problems
    Two Dimensional Situation: Strip Source of Heat in Boundary Layer and Channel Flow
    Three Dimensional Situations: Rectangular Source of Heat
    Enhanced Air Cooling of Electronic Equipment, S.V. Garimella
    Enhancement Strategies
    Enhancement Techniques
    Performance Evaluation Criteria
    Limits of Air Cooling - A Methodological Approach, K. Azar
    Thermal Phenomena in Electronic Enclosures
    Thermal Coupling in Electronic Enclosures
    Understanding The Concept of Cooling Limit
    Parameters Impacting Heat Transfer
    Potential Limits of Natural and Forced Convection Cooling


    Sung J. Kim and Sang W. Lee