3rd Edition

Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology Volume 2

797 Pages 100 Color & 364 B/W Illustrations
by CRC Press

797 Pages 100 Color & 364 B/W Illustrations
by CRC Press

Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology, the second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Third Edition, thoroughly examines real‑time logic (RTL) to GDSII generation, analog/mixed‑signal design, physical verification, and technology computer‑aided design (TCAD). Chapters contributed by leading... Read more

Section I — RTL to GDS‑II , or Synthesis, Place, and Route

Chapter 1 Design Flows
David Chinnery, Piyush Verma, Leon Stok, David Hathaway, and Kurt Keutzer


Chapter 2 Logic Synthesis
Ankush Sood, Taher Abbasi, Adel Khouja, Jean‑Charles Giomi, Sunil Khatri, and Narendra Shenoy


Chapter 3 Power Analysis and Optimization from Circuit to Register Transfer Levels
José Monteiro, Rakesh Patel, and Vivek Tiwari


Chapter 4 Equivalence Checking
Andreas Kuehlmann, Fabio Somenzi, Chih‑Jen Hsu, and Doron Bustan


Chapter 5 Digital Layout Placement
Andrew B. Kahng and Sherief Reda


Chapter 6 Static Timing Analysis
Vidya A. Chhabria, Jordi Cortadella, and Sachin S. Sapatnekar


Chapter 7 Structured Digital Design
Minsik Cho, Mihir Choudhury, Ruchir Puri, Haoxing Ren, Hua Xiang, Gi‑Joon Nam, Fan Mo, and Robert K. Brayton

Chapter 8 Routing
Gustavo E. Téllez, Jin Hu, and Yaoguang Wei


Chapter 9 Physical Design for 3D ICs
Sung‑Kyu Lim


Chapter 10 Gate Sizing
Stephan Held and Jiang Hu


Chapter 11 Clock Design and Synthesis
Matthew R. Guthaus

Chapter 12 Exploring Challenges of Libraries for Electronic Design
James Hogan, Scott T. Becker, and Neal Carney


Chapter 13 Design Closure
Peter J. Osler, John M. Cohn, and David Chinnery


Chapter 14 Tools for Chip‑Package Codesign
Paul D. Franzon and Madhavan Swaminathan


Chapter 15 Design Databases
Mark Bales


Chapter 16 FPGA Synthesis and Physical Design
Jason Anderson, Vaughn Betz, and Mike Hutton


Section II — Analog and Mixed‑Signal Design


Chapter 17 Simulation of Analog and RF Circuits and Systems
Jaijeet Roychowdhury and Alan Mantooth


Chapter 18 Simulation and Modeling for Analog and Mixed‑Signal Integrated Circuits
Georges G.E. Gielen and Joel R. Phillips


Chapter 19 Layout Tools for Analog Integrated Circuits and Mixed‑Signal Systems‑on‑Chip
John M. Cohn, Ramesh Harjani, Mark Po‑Hung Lin, Rob A. Rutenbar, and Sachin S. Sapatnekar


Section III — Physical Verification


Chapter 20 Design Rule Checking
Robert Todd, Laurence Grodd, Jimmy Tomblin, Katherine Fetty, and Daniel Liddell


Chapter 21 Resolution Enhancement Techniques and Mask Data Preparation
Franklin M. Schellenberg


Chapter 22 Design for Manufacturability in the Nanometer Era
Nicola Dragone, Carlo Guardiani, and Andrzej J. Strojwas


Chapter 23 Design and Analysis of Power Supply Networks
Rajendran Panda, Sanjay Pant, David Blaauw, and Rajat Chaudhry


Chapter 24 Noise in Digital ICs
Ashish Sharma and Ioannis Savidis

Chapter 25 Layout Extraction
William Kao, Chi‑Yuan Lo, Mark Basel, Raminderpa Singh, Peter Spink, and Louis K. Scheffer


Chapter 26 Mixed‑Signal Noise Coupling in System‑on‑Chip Design: Modeling, Analysis, and Validation
Nishath Verghese and Nagata Makoto


Section IV — Technology Computer‑Aided Design


Chapter 27 Process Simulation
Mark D. Johnson


Chapter 28 Device Modeling: From Physics to Electrical Parameter Extraction
Robert W. Dutton, Chang‑Hoon Choi, and Edwin C. Kan

Chapter 29 High‑Accuracy Parasitic Extraction
Zhengfeng (Jeff) Wu and Ioannis Savidis

Biography

Luciano Lavagno received his Ph.D. in EECS from U.C. Berkeley in 1992 and from Politecnico di Torino in 1993. He co-authored two books on asynchronous circuit design, a book on hardware/software co-design of embedded systems, and over 250 scientific papers. Between 1993 and 2000 he was the architect of the POLIS project, a cooperation between U.C. Berkeley, Cadence Design Systems, Magneti Marelli and Politecnico di Torino, which developed a complete hardware/software co-design environment for control-dominated embedded systems. Between 2003 and 2014 he was one of the creators and architects of the Cadence CtoSilicon high-level synthesis system. Since 2011, Dr. Lavagno has been a full professor with Politecnico di Torino, Italy. He has served on the technical committees of several international conferences in his field (e.g. DAC, DATE, ICCAD, ICCD, ASYNC, CODES) as well as various workshops and symposia and is a senior member of IEEE. He has also been an associate editor of IEEE TCAS and ACM TECS. His research interests include the high-level synthesis of digital circuits and the acceleration of Machine learning algorithms using Field Programmable Gate Arrays.

Grant E. Martin retired from his position as a distinguished engineer at Cadence Design Systems, Inc., San Jose, California, USA, in 2023. Before that, Grant worked for Burroughs in Scotland for 6 years; Nortel/Bell-Northern Research in Canada for 10 years; Cadence Design Systems for 9 years, eventually becoming a fellow in their labs; and Tensilica for 9 years. He rejoined Cadence in 2013 when it acquired Tensilica, and has been there since, working in the Tensilica part of the Cadence Intellectual Property Group. He received his bachelor’s and master’s degrees in mathematics (combinatorics and optimization) from the University of Waterloo, Ontario, Canada, in 1977 and 1978. Grant has coauthored and coedited several books, including the first-ever book on system-on-chip (SoC) design published in Russian. He has also presented many papers, talks, and tutorials, and participated in panels at several major conferences. He cochaired the VSI Alliance Embedded Systems Study Group in the summer of 2001 and was co-chair of the Design Automation Conference Technical Program Committee for Methods for 2005 and 2006. He is a senior member of IEEE. Although retired, he continues to have an interest in system-level design, IP-based design of system-on-chip, platform-based design, DSP, baseband and image processing, and embedded software.