1st Edition

Fabrication of SiGe HBT BiCMOS Technology

By John D. Cressler Copyright 2008
258 Pages 155 B/W Illustrations
by CRC Press

264 Pages 155 B/W Illustrations
by CRC Press

SiGe HBT BiCMOS technology is the obvious groundbreaker of the Si heterostructures application space. To date virtually every major player in the communications electronics market either has SiGe up and running in-house or is using someone else’s SiGe fab as foundry for their designers. Key to this success lies in successful integration of the SiGe HBT and Si CMOS, with no loss of performance from... Read more
Contents
Foreword; B.S. Meyerson
Introduction
The Big Picture; J.D. Cressler
A Brief History of the Field; J.D. Cressler
Fabrication of SiGe HBT BiCMOS Technology
Overview: Fabrication of SiGe HBT BiCMOS Technology; J.D. Cressler
Device Structures and BiCMOS Integration; D.L. Harame
SiGe HBTs on CMOS-Compatible SOI; J. Cai and T.H. Ning
Passive Components; J.N. Burghartz
Industry Examples at State-of-the-Art: IBM; A.J. Joseph and J.S. Dunn
Industry Examples at State-of-the-Art: Jazz; P.H.G. Kempf
Industry Examples at State-of-the-Art: Hitachi; K. Washio
Industry Examples at State-of-the-Art: Infineon; T.F. Meister, H. Schäfer, W. Perndl, and J. Böck
Industry Examples at State-of-the-Art: IHP; D. Knoll
Industry Examples at State-of-the-Art: ST; A. Chantre, M. Laurens, B. Szelag, H. Baudry, P. Chevalier, J. Mourier, G. Troillard, B. Martinet, M. Marty, and A. Monroy
Industry Examples at State-of-the-Art: Texas Instruments; B. El-Kareh, S. Balster, P. Steinmann, and H. Yasuda
Industry Examples at State-of-the-Art: Philips; R. Colclaser and P. Deixler

Biography

John D. Cressler