Guidebook for Managing Silicon Chip Reliability: 1st Edition (Hardback) book cover

Guidebook for Managing Silicon Chip Reliability

1st Edition

By Michael Pecht, Riko Radojcic, Gopal Rao

CRC Press

224 pages

Purchasing Options:$ = USD
Hardback: 9780849396243
pub: 1998-12-29
$170.00
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eBook (VitalSource) : 9780203719619
pub: 2017-11-22
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Description

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.

This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?

Chapters discuss:

  • failure sites, operational loads, and failure mechanism

  • intrinsic device sensitivities

  • electromigration

  • hot carrier aging

  • time dependent dielectric breakdown

  • mechanical stress induced migration

  • alpha particle sensitivity

  • electrostatic discharge (ESD) and electrical overstress

  • latch-up

  • qualification

  • screening

  • guidelines for designing reliability

    Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

  • Table of Contents

    Introduction

    How Devices Fail

    Intrinsic Mechanisms

    Extrinsic Mechanisms

    Intrinsic Device Sensitivities

    Device Transconductance Sensitivities

    Leakage Current Sensitivities

    Breakdown Issues

    Electromigration

    Description of the Mechanism

    Modeling of the Mechanism

    How to Detect/Test

    How to Manage

    Hot Carrier Aging

    Description of the Mechanism

    Modeling of the Mechanism

    Detection of Hot Carrier Aging

    Avoidance of Hot Carrier Aging

    Time Dependent Dielectric Breakdown

    Description of the Mechanism

    Modeling of the Mechanism

    How to Detect/Test

    How to Avoid and Manage

    Mechanical Stress Induced Migration

    Description of the Mechanism

    Modeling of the Mechanism

    How to Detect/Test

    How to Manage

    Alpha Particle Sensitivity

    Description of the Mechanism

    Modeling of the Mechanism

    Prevention of Alpha Particle Induced Damage

    Electrostatic Discharge and Electrical Overstress

    Description of the Mechanism

    Modeling of the Mechanism

    Avoiding ESD/EOS Failures

    Latch-Up

    Description of the Mechanism

    How to Detect

    How to Avoid

    Qualification

    Qualification Testing

    Virtual Qualification

    Screening

    Functional Tests

    Burn-In Tests

    Iddq Tests

    Design for Reliability

    Design System

    Effective Management of Wear-Out Failures

    Extrinsic Reliability Mechanisms

    Infant Mortality Failure Mechanisms

    Circuit Sensitivities

    Summary

    About the Series

    Electronic Packaging

    Learn more…

    Subject Categories

    BISAC Subject Codes/Headings:
    TEC008000
    TECHNOLOGY & ENGINEERING / Electronics / General
    TEC008010
    TECHNOLOGY & ENGINEERING / Electronics / Circuits / General
    TEC009070
    TECHNOLOGY & ENGINEERING / Mechanical