Handbook of Electronic Package Design: 1st Edition (Hardback) book cover

Handbook of Electronic Package Design

1st Edition

By Michael Pecht

CRC Press

904 pages

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Hardback: 9780824779214
pub: 1991-08-16
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eBook (VitalSource) : 9781315214085
pub: 2018-10-24
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Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development


"Prepared in a manner suitable for teaching and including end-of-chapter problems, this book well meets the needs for a teaching text. . ..Several useful appendices are also included. "

---IEEE Book Review

Table of Contents

"Introduction, Michael D. Osterman and Michael Pecht Electronic Components, Denise BurkusHarris, Michael Pecht, and Pradeep Lall Printed Wiring Board Design and Fabrication, Denise Burkus Harris and Pradeep Lall Electronic Assemblies, Denise Burkus Harris Interconnections and Connectors, Pradeep Lall and Michael Pecht Layout, Michael D. Osterman and Michael Pecht Thermal Design Analysis, Dennis K. Karr, David Dancer, and Milton Palmes, III Thermomechanical Analysis and Design, Abhijit Dasgupta Vibration and Shock Analysis and Design, Donald B. Barker Humidity and Corrosion Analysis and Design, Wing C. Ko and Michael Pecht Design for Reliability, Michael Pecht Electronic Materials and Properties, Jillian Y. Evans and John W. Evans Appendix A: Acronyms Used in Electronics Appendix B: Glossary of Hybrid Microcircuits Packaging Terms Appendix C: Standards and Specifications for Microelectronics Appendix D: Standards and Specifications for PCBs and PWBs Appendix E: Unit Conversion Tables "

About the Series

Mechanical Engineering

A Series of Textbooks and Reference Books

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Subject Categories

BISAC Subject Codes/Headings:
TECHNOLOGY & ENGINEERING / Electronics / General