Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Preface
Contributors
Introduction
Michael D. Osterman and Michael Pecht
Electronic Components
Denise Burkus Harris, Michael Pecht, and Pradeep Lall
Printed Wiring Board Design and Fabrication
Denise Burkus Harris and Pradeep Lall
Electronic Assemblies
Denise Burkus Harris
Interconnections and Connectors
Pradeep Lall and Michel Pecht
Layout
Michael D. Osterman and Michael Pecht
Thermal Design Analysis
Dennis K. Karr, Milton Palmer, III, and David Dancer
Thermomechanical Analysis and Design
Abhijit Dasgupta
Design for Vibration and Shock
Donald B. Barker
Humidity and Corrosion Analysis and Design
Wing C. Ko and Michael Pecht
Design for Reliability
Michael Pecht
Electronic Materials and Properties
Jillian Y. Evans and John W. Evans
Appendix A: Acronyms Used in Electronics
Appendix B: Glossary of Hybrid Microcircuits Packaging Terms
Appendix C: Standards and Specifications for Microelectronics
Appendix D: Standards and Specifications for PCBs and PWBs
Appendix E: Unit Conversion Tables
Index
Biography
Michael Pecht
"Prepared in a manner suitable for teaching and including end-of-chapter problems, this book well meets the needs for a teaching text. . ..Several useful appendices are also included. "
---IEEE Book Review
