2nd Edition
Handbook of Surface and Interface Analysis Methods for Problem-Solving, Second Edition
Introduction, J. C. Rivière and S. Myhra
Problem Solving: Strategy, Tactics, and Resources, S. Myhra and J. C. Rivière
Photoelectron Spectroscopy (XPS and UPS), Auger Electron Spectroscopy (AES), and Ion Scattering Spectroscopy (ISS), V. Y. Young and G. B. Hoflund
Ion Beam Techniques: Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS), B. Hagenhoff, R. Kersting, and D. Rading
Surface and Interface Analysis by Scanning Probe Microscopy, S. Myhra
Transmission Electron Microscopy: Instrumentation, Imaging Modes, and Analytical Attachments
J. M. Titchmarsh
Synchrotron-Based Techniques, A. R. Gerson, D. J. Cookson, and K. C. Prince
Quantifi cation of Surface and Near-Surface Composition by AES and XPS, S. Tougaard
Structural and Analytical Methods for Surfaces and Interfaces: Transmission Electron Microscopy, J. M. Titchmarsh
In-Depth Analysis/Profiling, F. Reniers and C. R. Tewell
Characterization of Nanostructured Materials, M. Werner, A. Crossley, and C. Johnston
Problem-Solving Methods in Tribology with Surface-Specifi c Techniques, C. Donnet and J.-M. Martin
Problem-Solving Methods in Surface Analysis Metallurgy, R. K. Wild
Composites, P. M. A. Sherwood
Minerals, Ceramics, and Glasses, R. St. C. Smart and Z. Zhang
Catalyst Characterization, W. E. S. Unger and T. Gross
Surface Analysis of Biomaterials, M. Jasieniak, D. Graham, P. Kingshott, L. J. Gamble, and H. J. Griesser
Adhesion Science and Technology, J. F. Watts
Electron Spectroscopy in Corrosion Science, J. E. Castle
Biography
John C. Riviere, Sverre Myhra
This handbook on surface and interface analysis can help to create that knowledgeable person … sufficient in-depth technical information to satisfy those who want to know the details … Material scientists, engineers, materials researchers, or anyone who needs information about a material obtained using surface analysis methods will find this handbook an excellent resource for determining the best approach and the right techniques to use.
—IEEE Electrical Insulation Magazine, Vol. 26, No. 3, May-June 2010






