1st Edition

Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon

ISBN 9780815514428
Published February 1, 2002 by CRC Press
72 Pages

USD $450.00

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Book Description

The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition.

This second edition explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of submicron dimensions. The book covers PVD, laser and E-beam assisted deposition, MBE, and ion beam methods to bring together all of the physical vapor deposition techniques. The book also includes coverage of chemical mechanical polishing that helps attain the flatness that is required by modern lithography methods and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

Table of Contents

Recent Changes in the Semiconductor Industry
Deposition Technologies and Applications: Introduction and Overview
Silicon Epitaxy by Chemical Vapor Deposition
Chemical Vapor Deposition of Silicon Dioxide Films
Metal Organic Chemical Vapor Deposition: Technology and Equipment
Feature Scale Modeling
The Role of Metrology and Inspection in Semiconductor Processing
Contamination Control, Defect Detection, and Yield Enhancement in Gigabit Manufacturing
Sputtering and Sputter Deposition
Laser and Electron Beam Assisted Processing
Molecular Beam Epitaxy: Equipment and Practice
Ion Beam Deposition
Chemical Mechanical Polishing
Organic Dielectrics in Multilevel Metalization of Integrated Circuits
Performance, Processing, and Lithography Trends

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