Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon: 1st Edition (Hardback) book cover

Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon

1st Edition

By Krishna Seshan

CRC Press

72 pages

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Hardback: 9780815514428
pub: 2002-02-01
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Description

The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition.

This second edition explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of submicron dimensions. The book covers PVD, laser and E-beam assisted deposition, MBE, and ion beam methods to bring together all of the physical vapor deposition techniques. The book also includes coverage of chemical mechanical polishing that helps attain the flatness that is required by modern lithography methods and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

Table of Contents

Recent Changes in the Semiconductor Industry

Deposition Technologies and Applications: Introduction and Overview

Silicon Epitaxy by Chemical Vapor Deposition

Chemical Vapor Deposition of Silicon Dioxide Films

Metal Organic Chemical Vapor Deposition: Technology and Equipment

Feature Scale Modeling

The Role of Metrology and Inspection in Semiconductor Processing

Contamination Control, Defect Detection, and Yield Enhancement in Gigabit Manufacturing

Sputtering and Sputter Deposition

Laser and Electron Beam Assisted Processing

Molecular Beam Epitaxy: Equipment and Practice

Ion Beam Deposition

Chemical Mechanical Polishing

Organic Dielectrics in Multilevel Metalization of Integrated Circuits

Performance, Processing, and Lithography Trends

Index

Subject Categories

BISAC Subject Codes/Headings:
SCI055000
SCIENCE / Physics
TEC021000
TECHNOLOGY & ENGINEERING / Material Science