Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
"The new edition brings the baseline IC technology and tool set up to date. . ..it covers all the material in more depth than the first edition. . .. . . .a good tutorial on IC fabrication and packaging, including quality concerns. . .. Excellent chapters on design, fabrication, packaging, and test put today's engineer in a good position to understand the impact of contamination and manufacturing errors on their IC products. "
---IEEE Components, Packaging, and Manufacturing Technology Society Newsletter
Overview. Part 1 Introduction to integrated circuit manufacturing processes: front-end IC fabrication operations; back-end fabrication operations; in-line process monitors and test structures. Part 2 Impact of new technologies: circuit design trends; changing fabrication techniques; packaging technology trends; electrical testing of VLSICs and ASICs. Part 3 Contamination and manufacturing errors: contamination; human contamination (people); IC processing contamination; contamination control; computer-based sources of error in design and test circuit design; material issues. Part 4 Causes (sources) of IC failures: fabrication-related causes of defects; packaging and assembly related causes of IC failures; reliability improvement. Part 5 Introduction to screening: screening.