Materials for Advanced Semiconductor Packaging and Heterogeneous Integ

Description

Advanced semiconductor packaging and heterogeneous integration have become a critical area to enable semiconductor devices with high performance, high functional density, high reliability, and low cost. Advancement in semiconductor packaging technology, in turn, depends critically on innovative materials, for miniaturization and high I/O density, signal integrity, power integrity, thermal... Read more

Advanced semiconductor packaging and heterogeneous integration have become a critical area to enable semiconductor devices with high performance, high functional density, high reliability, and low cost. Advancement in semiconductor packaging technology, in turn, depends critically on innovative materials, for miniaturization and high I/O density, signal integrity, power integrity, thermal integrity, reliability, as well as manufacturing quality and cost. Sustainability, another important consideration for semiconductor and microelectronics devices and for the industry as a whole, also depends directly on innovative materials solutions.

This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration. Chapter 1 is an overview of semiconductor packaging technologies, outlining the role of materials in various packaging configurations and heterogeneous integration solutions. Chapter 2 reviews substrate and interposer materials (organic, glass and ceramic) and printed circuit boards. Chapter 3 discusses innovative solder materials for miniaturized interconnects, and Chapter 4 is focused on materials for flexible electronics. Chapter 5 covers materials for thermal management, which is critical for high performance semiconductor devices, and Chapter 6 covers materials for encapsulation, including underfill, molding compound, conformal coating, etc. Chapter 7 discusses how materials can affect the reliability of semiconductor packaging – particularly for AI and HPC applications, and Chapter 8 provides an overview of materials analysis and testing methodologies and techniques.

This book is aimed at academic and industry researchers, as well as industry practitioners. It covers fundamental aspects as well as practical considerations, and it will serve as a comprehensive source of the most up-to-date knowledge, and a review of the state of the art of the technology and applications, for innovative materials for advanced semiconductor packaging and heterogeneous integration.

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Editor(s)

Biography

Dongkai Shangguan, IEEE Fellow & IMAPS Fellow, is President of Thermal Engineering Associates, Inc., a provider of analog ASIC chips for thermal testing. He is also a Strategic Advisor to Indium Corporation, a provider of innovative materials for advanced semiconductor packaging and electronics assembly. Previously, he served as Vice President for Technology & Engineering at Flex (formerly Flextronics), a leading global player for electronics design and manufacturing, and as Vice President at STATS ChipPAC (currently JCET), a leading provider of semiconductor assembly and test services. Early in his career, he held various technical and management responsibilities at Ford and Visteon on automotive electronics.

Shangguan has published several books and authored/co-authored over 200 technical papers, and has been issued 34 U.S. patents. He is an IEEE EPS Distinguished Lecturer, and has given numerous keynotes, seminars and lectures globally.

Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, the Daniel C. Hughes Jr. Memorial Award and the William D. Ashman Achievement Award from IMAPS, the President’s Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers, among others.

Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. degree in Materials from the University of Oxford, U.K. He conducted post-doctoral teaching and research at the University of Cambridge and The University of Alabama, and has served as a guest professor at several universities.

Shangguan is based in San Jose, California, and travels globally in service of the industry

Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

Description

Table of Contents

Editor(s)

Biography

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