Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

1. Advanced Packaging Architectures and the Role of Materials in Their Evolution

Ravi Mahajan, Ashay Dani, Debendra Mallik, Gaurang Choksi, and Bhaskar Jyoti Krishnatreya

2. Substrate and Interposer Materials for Semiconductor Packaging and Heterogeneous Integration

Tarak A. Railkar

3. Materials for Solder Interconnects

Hongwen Zhang

4. Materials for Flexible Electronics

Weifeng Liu

5. Materials for Thermal Management for Advanced Semiconductor Packaging

Naarendharan Meenakshi Sundaram, Min Jong Kil, Dongkai Shangguan, Subramanian Iyer, and Timothy Fisher

6. Encapsulation Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

Zihao Lin and Ching‑Ping Wong

7. Interconnect Reliability for High‑Performance Semiconductor Packages and Devices

Tae‑Kyu Lee

8. Characterization, Testing, Simulation, and Failure Analysis of Materials in Advanced Semiconductor Packaging

Yan Li

Biography

Dongkai Shangguan, IEEE Fellow and IMAPS Fellow, is President of Thermal Engineering Associates, Inc., a provider of analog ASIC chips for thermal testing. He is also a Strategic Advisor to Indium Corporation, a provider of innovative materials for advanced semiconductor packaging and electronics assembly. Previously, he served as Vice President for Technology and Engineering at Flex (formerly Flextronics), a leading global player for electronics design and manufacturing, and as Vice President at STATS ChipPAC (currently JCET), a leading provider of semiconductor assembly and test services. Early in his career, he held various technical and management responsibilities at Ford and Visteon on automotive electronics.

Shangguan has published several books, authored or co‑authored over 200 technical papers, and has been issued 34 U.S. patents. He is an IEEE EPS Distinguished Lecturer and has given numerous keynotes, seminars, and lectures globally.

Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, the Daniel C. Hughes Jr. Memorial Award and the William D. Ashman Achievement Award from IMAPS, the President’s Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers, among others.

Shangguan earned a BSc in Mechanical Engineering at Tsinghua University, China, an MBA at San Jose State University, and a PhD in Materials at the University of Oxford, UK. He conducted postdoctoral teaching and research at the University of Cambridge and the University of Alabama, and he has served as a guest professor at several universities.

Shangguan is based in San Jose, California, and travels globally in service of the industry.