Materials for Rigid and Flexible Printed Wiring Boards: 1st Edition (Hardback) book cover

Materials for Rigid and Flexible Printed Wiring Boards

1st Edition

By Martin W. Jawitz, Michael J. Jawitz

CRC Press

169 pages | 37 B/W Illus.

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Hardback: 9780824724337
pub: 2006-09-22
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pub: 2018-10-03
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Description

Complex electronic circuits and devices are flooding applications in nearly every facet of commercial and industrial activity, from automated equipment to all types of consumer products. Proper selection of materials is crucial to meet the end-use requirements of flexible and rigid printed wiring boards. While there are many useful books and articles on the fabrication of printed circuit boards, Materials for Rigid and Flexible Printed Wiring Boards is the first book to detail the properties of the materials used and how they are made.

The authors present important manufacturing information and material properties for reinforcement materials, resins, flexible films, copper foils, rigid laminates, high-speed/high-frequency laminates, and metal core and constraining core materials. They offer practical guidance to help designers, engineers, and fabricators choose suitable materials to successfully meet strength, weight, thickness, performance, cost, and other requirements. In most cases, the material data comes directly from manufacturers' data sheets, representing typical values. The book illustrates the comparative strengths and limitations of the materials, highlights their basic properties, and details the manufacturing processes used to make them.

Offering practical guidance based on years of experience, Materials for Rigid and Flexible Printed Wiring Boards is a one-stop source of crucial information for anyone designing or building printed circuit boards for any application.

Table of Contents

REINFORCEMENT MATERIALS

Reinforcement Materials-Rigid

Glass

Glass Composition

Glass Fiber Manufacturing

From Yarn to Fabric

Glass Types and Construction

Glass Fabric Weave

Surfacing Mat, Paper or Veil

Glass Fiber Paper

Quartz

Properties of Glass Fabrics

Aramids

Constraining Dielectric Materials (Kevlar®)

RESINS

Introduction

Polyester Resin

Epoxy

Polyimide

Cyanate Ester and Cyanate Ester Blends (BT Resin)

Polyphenylene Oxide (PPO) Epoxy Blends

Polytetrafluoroethylene Resin (PTFE)

FLEXIBLE FILMS

Introduction

Types of Flexible Materials

Adhesives

Cover Coat/Coverlay

Bondplies

Conductive Materials

Copper Clad Laminates

COPPER FOILS

Introduction

Electrodeposited Copper Foil

Rolled Copper Foils

Grades

Nickel Foil

LAMINATES, RIGID

Introduction

NEMA Grades

Composite Laminates

Rigid Laminates (Glass Reinforced)

Laminates, Rigid Glass Reinforced

Aramid Laminates

Prepreg

Additive Laminates

HIGH-SPEED/HIGH-FREQUENCY LAMINATES

Introduction

High-Speed/High-Frequency Laminates

Thin Laminates

Resins

High-Frequency Laminate Designations

Laminate Construction

Bonding

Dimensional Stability

Drilling

References

METAL CORE AND CONSTRAINING CORE MATERIALS

Introduction

Copper-Invar-Copper (CIC)

Copper-Molybdenum-Copper (CMC)

Silicon Carbide Reinforced Aluminum (SiC/Al)

Coefficient of Thermal Expansion Trade-Offs (CTE)

APPENDIX

INDEX

About the Series

Electrical and Computer Engineering

Learn more…

Subject Categories

BISAC Subject Codes/Headings:
TEC008000
TECHNOLOGY & ENGINEERING / Electronics / General
TEC008010
TECHNOLOGY & ENGINEERING / Electronics / Circuits / General
TEC021000
TECHNOLOGY & ENGINEERING / Material Science