1st Edition

Materials for Rigid and Flexible Printed Wiring Boards




ISBN 9780824724337
Published September 22, 2006 by CRC Press
192 Pages 37 B/W Illustrations

USD $220.00

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Book Description

Complex electronic circuits and devices are flooding applications in nearly every facet of commercial and industrial activity, from automated equipment to all types of consumer products. Proper selection of materials is crucial to meet the end-use requirements of flexible and rigid printed wiring boards. While there are many useful books and articles on the fabrication of printed circuit boards, Materials for Rigid and Flexible Printed Wiring Boards is the first book to detail the properties of the materials used and how they are made.

The authors present important manufacturing information and material properties for reinforcement materials, resins, flexible films, copper foils, rigid laminates, high-speed/high-frequency laminates, and metal core and constraining core materials. They offer practical guidance to help designers, engineers, and fabricators choose suitable materials to successfully meet strength, weight, thickness, performance, cost, and other requirements. In most cases, the material data comes directly from manufacturers' data sheets, representing typical values. The book illustrates the comparative strengths and limitations of the materials, highlights their basic properties, and details the manufacturing processes used to make them.

Offering practical guidance based on years of experience, Materials for Rigid and Flexible Printed Wiring Boards is a one-stop source of crucial information for anyone designing or building printed circuit boards for any application.

Table of Contents

REINFORCEMENT MATERIALS
Reinforcement Materials-Rigid
Glass
Glass Composition
Glass Fiber Manufacturing
From Yarn to Fabric
Glass Types and Construction
Glass Fabric Weave
Surfacing Mat, Paper or Veil
Glass Fiber Paper
Quartz
Properties of Glass Fabrics
Aramids
Constraining Dielectric Materials (Kevlar®)

RESINS
Introduction
Polyester Resin
Epoxy
Polyimide
Cyanate Ester and Cyanate Ester Blends (BT Resin)
Polyphenylene Oxide (PPO) Epoxy Blends
Polytetrafluoroethylene Resin (PTFE)

FLEXIBLE FILMS
Introduction
Types of Flexible Materials
Adhesives
Cover Coat/Coverlay
Bondplies
Conductive Materials
Copper Clad Laminates

COPPER FOILS
Introduction
Electrodeposited Copper Foil
Rolled Copper Foils
Grades
Nickel Foil

LAMINATES, RIGID
Introduction
NEMA Grades
Composite Laminates
Rigid Laminates (Glass Reinforced)
Laminates, Rigid Glass Reinforced
Aramid Laminates
Prepreg
Additive Laminates

HIGH-SPEED/HIGH-FREQUENCY LAMINATES
Introduction
High-Speed/High-Frequency Laminates
Thin Laminates
Resins
High-Frequency Laminate Designations
Laminate Construction
Bonding
Dimensional Stability
Drilling
References

METAL CORE AND CONSTRAINING CORE MATERIALS
Introduction
Copper-Invar-Copper (CIC)
Copper-Molybdenum-Copper (CMC)
Silicon Carbide Reinforced Aluminum (SiC/Al)
Coefficient of Thermal Expansion Trade-Offs (CTE)
APPENDIX
INDEX

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