This book presents a comprehensive review, evaluation, and summary of the dependence of mechanical properties on grain and particle parameters of monolithic ceramics and ceramic composites. Emphasizing the critical link between fabrication and ceramic performance, the book covers the grain dependence of monolithic properties and the dependence of ceramic, composite properties on grain and particulate parameters. It includes theoretical and conceptual background, pertinent models, experimental results, a data review, discussion, and a summary or recommendations. Illustrations feature microstructural details while graphs plot data on material hardness, compressive strength, and other pivotal variables.
Table of Contents
1. Introduction to Grain and Particle Effects on Ceramic and Ceramic Composite Properties Part I: Grain Dependence of Monolithic Ceramic Properties 2. Grain Dependence of Microcracking, Crack Propagation, and Fracture Toughness at ~ 22°C 3. Grain Dependence of Ceramic Tensile Strengths at ~ 22°C 4. Grain Dependence of Indentation Hardness at ~ 22°C 5. Grain Dependence of Compressive Strength, Wear, and Related Behavior at ~ 22°C 6. Grain Effects on Thermal Shock Resistance and Elevated Temperature Crack Propagation, Toughness, and Tensile Strength 7. Grain Dependence of Hardness, Compressive Strength, Wear, and Related Behavior at Elevated Temperatures Part II: Dependence of Ceramic, Especially Particulate, Composite Properties on Grain and Particle Parameters 8. Particle (and Grain) Effects on Elastic Properties, Crack Propagation, and Fracture Toughness of Ceramic Composites at ~ 22°C 9. Particle Dependence of Tensile Strength of Ceramic Composites at ~ 22°C 10. Composite Particle and Grain Effects on Hardness, Compressive Strength, Wear, and Related Behavior at ~ 22°C 11. Particle and Grain Effects on Mechanical Properties of Composites at Elevated Temperature 12. Summary and Perspective for the Microstructural Dependence of Mechanical Properties of Dense Monolithic and Composite Ceramics
Rice, Roy W.