1st Edition
Multi-scale and Multi-physics Simulation of Fracture and Fatigue
Acknowledgement
Preface
Author bio
1. Introduction to Fracture Mechanics and Fatigue in Materials at Different Length Scales
2. An Overview of the Finite Element Method
3. An Overview of Molecular Dynamics (MD) for Atomistic Simulation
4. Development of the Atomistic J-integral: Energetic and Entropic Effects
5. Length-Scale Effects and a Novel K-Field Approach to Modeling
6. Concurrent Multiscale Coupling of FEM and MD To Simulate Fracture in Brittle Materials
7. Modeling of Fracture in Crystalline Materials using MD and Extraction of Cohesive Zone Parameters
8. Modeling of Fracture in Amorphous Materials using MD
9. Crack-tip Shielding Effect due to Embedded Nanoparticles in a Matrix Material
10. Mode-II and Mode I Fatigue Loading in Amorphous Carbon using Steered-MD Based K-Test Approach
Biography
Samit Roy is the William D. Jordan Endowed Professor in the Department of Aerospace Engineering and Mechanics at the University of Alabama, USA. He holds a Ph.D. in Engineering Science & Mechanics from Virginia Tech. Dr. Roy's research focuses on multi-scale modeling and life-prediction of fiber-reinforced polymer composites, nanostructured reinforcements, and structural health management including self-healing smart materials. He has authored over 200 peer-reviewed publications. His distinguished honors include Fellow of ASME, Fellow of the American Society for Composites, ASC Outstanding Researcher Award, and ASC/DesTech Award. He served as Division Chair of ASC's Emerging Composite Technologies Technical Division in 2022.
Sankha Subhra Aditya is currently a postdoctoral researcher at the University of Texas, USA. He completed his Ph.D. in Aerospace Engineering and Mechanics at the University of Alabama under the guidance of Prof. Samit Roy. He received his undergraduate education from the Indian Institute of Technology (IIT) Kharagpur in Aerospace Engineering. His research interests encompass a variety of applications, including polymer composites and electronics packaging, with his contributions focusing on multiscale modeling of materials and structures, as well as theoretical fracture mechanics
