1st Edition

Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design

222 Pages 130 B/W Illustrations
by CRC Press

222 Pages 130 B/W Illustrations
by CRC Press

222 Pages 130 B/W Illustrations
by CRC Press

Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significance of novel nano-interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube... Read more

1 Nanomaterials for Next-Generation Interconnects

Aditya Tiwari, Sangeeta Jana Mukhopadhyay, and Sayan Kanungo

2 Interconnect Modeling Using Graphene Nanoribbon (GNR)

Wen-Sheng Zhao

3 Introduction to Nanoscale Interconnect Materials

Laxman Raju Thoutam and Shantikumar Nair

4 Analysis of Simultaneous Switching Noise and IR Drop

Debaprasad Das, Mounika Bandi, Sandip Bhattacharya, and Subhajit Das

5 Temperature-Dependent RF Performance Analysis of GNR-Based Nano-Interconnect Systems

Santasri Giri Tunga, Hafizur Rahaman, and Subhajit Das

6 Electro-Thermal Modeling of CNT and GNR Interconnect for Nano-Electronic Circuits

Santasri Giri Tunga, Subhajit Das, and Hafizur Rahaman

7 Hybrid Cu-Carbon as Interconnect Materials and Their Interconnect Models

Bhawana Kumari and Manodipan Sahoo

8 Hybrid Cu-CNT Composite as Interconnect Materials and Their Equivalent Models

Shivangi Chandrakar and Manoj Kumar Majumder

9 Relative Stability Analysis of the GNR and Cu Interconnect

Sandip Bhattacharya, L. M. I. Leo Joseph, Sheshikala Martha, Ch. Rajendra Prasad, Syed Musthak Ahmed, Subhajit Das, Debaprasad Das, and P. Anuradha

10 Transmission Line-Based Modeling of CNT and GNR Interconnects Using Numerical Methods

Shashank Rebelli

Biography

Sandip Bhattacharya received his Ph.D. (Eng.) degree from the Indian Institute of Engineering Science and Technology (IIEST), India, in 2017. From October 2017 to December 2020, he worked as a postdoctoral researcher at the HiSIM research center, Hiroshima University, Japan. He is currently working as an Associate Professor and Head of the Department of Electronics and Communication Engineering at SR University, Warangal, Telangana, India. His current research interests are nano device and interconnect modeling.

J. Ajayan received his B.Tech. degree in Electronics and Communication Engineering from Kerala University in 2009, and M.Tech. and Ph.D. degrees in Electronics and Communication Engineering from Karunya University, Coimbatore, India, in 2012 and 2017, respectively. He is an Associate Professor in the Department of Electronics and Communication Engineering at SR University, Telangana, India. He has published more than 100 research articles in various journals and international conferences. He has published two books, more than ten book chapters, and has two patents. He is a reviewer of more than 30 journals for various publishers. He was the Guest Editor for several of the special issues. His areas of interest are microelectronics, semiconductor devices, nanotechnology, RF integrated circuits, and photovoltaics.

Fernando Avila Herrera has worked in the field of academic and semiconductor industry. He has involved with the modeling and characterization of semiconductor devices, especially MOSFETs. Further, he has experience in device reliability modeling, model parameter extraction, Verilog-A, TCAD, and EDA tools. He also has experience in HiSIM family models for parameter extraction and physics modeling and FPGA programming. He has collaborated with different groups for developing compact models.