1st Edition
Nanoparticle Engineering for Chemical-Mechanical Planarization Fabrication of Next-Generation Nanodevices
224 Pages
by
CRC Press
224 Pages
by
CRC Press
In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as... Read more
Overview of CMP Technology. Interlayer Dielectric CMP Shallow Trench Isolation CMP. Copper CMP. Nanotopography. Novel CMP for Next-Generation Devices. References. Index.
Biography
Hanyang University, Seoul, South Korea
