600 pages | 25 Color Illus. | 477 B/W Illus.
Where conventional testing and inspection techniques fail at the microscale, optical techniques provide a fast, robust, noninvasive, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands.
Optical Inspection of Microsystems, Second Edition, extends and updates the first comprehensive survey of the most important optical measurement techniques to be successfully used for the inspection of microsystems. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image processing, image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moire techniques, interference microscopy, laser-Doppler vibrometry, digital holography, speckle metrology, spectroscopy, and sensor fusion technologies. They also examine modern approaches to data acquisition and processing, such as the determination of surface features and the estimation of uncertainty of measurement results. The book emphasizes the evaluation of various system properties and considers encapsulated components to increase quality and reliability. Numerous practical examples and illustrations of optical testing reinforce the concepts.
Supplying effective tools for increased quality and reliability, this book
Image Processing and Computer Vision for MEMS Testing; Image Correlation Techniques for Microsystems Inspection; Light
Scattering Techniques for the Inspection of Microcomponents and Microstructures; Characterization and Measurement of
Microcomponents with the Atomic Force Microscope (AFM); Optical Profiling Techniques for MEMS Measurement; Grid and Moiré
Methods for Micromeasurements; Grating Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents;
Interference Microscopy Techniques for Microsystem Characterization; Measuring MEMS in Motion by Laser Doppler Vibrometry;
An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-Of-Plane Deformations of MEMS and MOEMS;
Optoelectronic Holography for Testing Electronic Packaging and MEMS; Digital Holography and Its Application in MEMS/MOEMS
Inspection; Speckle Metrology for Microsystem Inspection; Spectroscopic Techniques for MEMS Inspection; Calibration of Optical
Measurement Systems for the inspection of MEMS, Numerical Tools for the Characterization of Microelectromechanical Systems,
Deflectometry for the inspection of MEMS, Digital Holographic Microscopy.