2nd Edition

Optical Inspection of Microsystems, Second Edition

Edited By Wolfgang Osten Copyright 2020
    584 Pages 25 Color & 477 B/W Illustrations
    by CRC Press

    584 Pages 25 Color & 477 B/W Illustrations
    by CRC Press

    Where conventional testing and inspection techniques fail at the microscale, optical techniques provide a fast, robust, noninvasive, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands.

    Optical Inspection of Microsystems, Second Edition, extends and updates the first comprehensive survey of the most important optical measurement techniques to be successfully used for the inspection of microsystems. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image processing, image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moire techniques, interference microscopy, laser-Doppler vibrometry, digital holography, speckle metrology, spectroscopy, and sensor fusion technologies. They also examine modern approaches to data acquisition and processing, such as the determination of surface features and the estimation of uncertainty of measurement results. The book emphasizes the evaluation of various system properties and considers encapsulated components to increase quality and reliability. Numerous practical examples and illustrations of optical testing reinforce the concepts.

    Supplying effective tools for increased quality and reliability, this book

    • Provides a comprehensive, up-to-date overview of optical techniques for the measurement and inspection of microsystems
    • Discusses image correlation, displacement and strain measurement, electro-optic holography, and speckle metrology techniques
    • Offers numerous practical examples and illustrations
    • Includes calibration of optical measurement systems for the inspection of MEMS
    • Presents the characterization of dynamics of MEMS

    1. Image Processing and Computer Vision for MEMS Testing

    [Markus Hüttel]

    2. Surface Features

    [Xiangqian Jiang]

    3. A Metrological Characteristics Approach to Uncertainty in Surface Metrology

    [Richard Leach, Han Haitjema, and Claudiu Giusca]

    4. Image Correlation Techniques for Microsystems Inspection

    [Dietmar Vogel and Bernd Michel]

    5. Light Scattering Techniques for the Inspection of Microcomponents and Structures

    [Angela Duparré and Sven Schröder]

    6. Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM)

    [F. Michael Serry and Joanna Schmit]

    7. Optical Profiling Techniques for MEMS Measurement

    [Klaus Körner, Johann Krauter, Aiko Ruprecht, and Tobias Wiesendanger]

    8. Grid and Moiré Methods for Micromeasurements

    [Anand Asundi, Bing Zhao, and Huimin Xie]

    9. Grating (Moiré) Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents

    [Leszek Salbut and Malgorzata Kujawinska]

    10. Interference Microscopy Techniques for Microsystem Characterization

    [Alain Bosseboeuf, Philippe Coste, and Sylvain Petitgrand]

    11. Measuring MEMS in Motion by Laser Doppler Vibrometry

    [Christian Rembe, Georg Siegmund, Heinrich Steger, and Michael Wörtge]

    12. An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-of-Plane Deformations of MEMS and MOEMS

    [Christophe Gorecki, Michał Józwik, and Patrick Delobelle]

    13. Optoelectronic Holography for Testing Electronic Packaging and MEMS

    [Cosme Furlong]

    14. Digital Holography and Its Application in MEMS/MOEMS Inspection

    [Wolfgang Osten and Pietro Ferraro]

    15. Speckle Metrology for Microsystem Inspection

    [Roland Höfling and Petra Aswendt]

    16. Spectroscopic Techniques for MEMS Inspection

    [Ingrid De Wolf]

    17. Sensor Fusion in Multiscale Inspection Systems

    [Marc Gronle]


    Wolfgang Osten earned an MSc/Diploma in physics at Friedrich Schiller University Jena in 1979. From 1979 to 1984 he was a member of the Institute of Mechanics in Berlin, working in the field of experimental stress analysis and optical metrology. In 1983 he earned a PhD at the Martin Luther University Halle-Wittenberg for his thesis in the field of holographic interferometry. From 1984 to 1991 he was employed at the Central Institute of Cybernetics and Information Processes ZKI in Berlin, making investigations in digital image processing and computer vision. Between 1988 and 1991 he headed the Institute for Digital Image Processing at ZKI. From 1991 to 2002 he joined the Bremen Institute of Applied Beam Technology (BIAS) to establish and direct the Department of Optical 3D-Metrology. From September 2002 to October 2018 he was a full professor at the University of Stuttgart and director of the Institute for Applied Optics. From 2006 to 2010 he was the vice rector for research and technology transfer at Stuttgart University, and from 2015 to 2018 he was the vice chair of the university council. His research is focused on new concepts for industrial inspection and metrology by combining modern principles of optical metrology, sensor technology, and image processing. He directs special attention to the development of resolution-enhanced technologies for the investigation of micro- and nanostructures.