1st Edition
Particles on Surfaces: Detection, Adhesion and Removal, Volume 8
Edited By Kash L. Mittal
Copyright 2003
352 Pages
by
CRC Press
352 Pages
by
CRC Press
Also available as eBook on:
This volume documents the proceedings of the 8th International Symposium on Particles on Surfaces: Detection, Adhesion and Removal held in Providence, Rhode Island, June 24–26, 2002.
The study of particles on surfaces is extremely crucial in a host of diverse technological areas, ranging from microelectronics to optics to biomedical. In a world of shrinking dimensions and with the tremendous... Read more
Preface
Part 1: Particle Analysis / Characterization and General Cleaning-Related Topics
The nature and characterization of small particles
R. Kohli
Surface and micro-analytical methods for particle identification
D.A. Cole, J. Humenansky, M. Kendall, P.J. McKeown, V. Pajcini and J.H. Scherer
The haze of a wafer: A new approach to monitor nano-sized particles
K. Xu, R. Vos, G. Vereecke, M. Lux, W. Fyen, F. Holsteyns, K. Kenis, P.W. Mertens, M.M. Heyns and C. Vinckier
Particle transport and adhesion in an ultra-clean ion-beam sputter deposition process
C.C. Walton, D.J. Rader, J.A. Folta and D.W. Sweeney
Particle deposition from a carry-over layer during immersion rinsing
W. Fyen, K. Xu, R. Vos, G. Vereecke, P. Mertens and M. Heyns
The use of surfactants to reduce particulate contamination on surfaces
M.L. Free
The use of rectangular jets for surface decontamination
E.S. Geskin and B. Goldenberg
Ice-air blast cleaning: Case studies
D. Shishkin, E. Geskin, B. Goldenberg and O. Petrenko
Development of a technique for glass cleaning in the course of demanufacturing of electronic products
E.S. Geskin, B. Goldenberg and R. Caudill
Part 2: Particle Adhesion and Removal
Mechanics of nanoparticle adhesion — A continuum approach
J. Tomas
A new thermodynamic theory of adhesion of particles on surfaces
M.A. Melehy
Particle adhesion on nanoscale rough surfaces
B.M. Moudgil, Y.I. Rabinovich, M.S. Esayanur and R.K. Singh
Advanced wet cleaning of sub-micrometer sized particles
R. Vos, K. Xu, G. Vereecke, F. Holsteyns, W. Fyen, L. Wang, J. Lauerhaas, M. Hoffman, T. Hackett, P. Mertens and M. Heyns
Modified SC-1 solutions for silicon wafer cleaning
C. Beaudry, J. Baker, R. Gouk and S. Verhaverbeke
Investigation of ozonated DI water in semiconductor wafer cleaning
J. DeBello and L. Liu
Possible post-CMP cleaning processes for STI ceria slurries
R. Small and B. Scott
The ideal ultrasonic parameters for delicate parts cleaning
T. Piazza and W.L. Puskas
Effects of megasonics coupled with SC-1 process parameters on particle removal on 300-mm silicon wafers
S.L. Wicks, M.S. Lucey and J.J. Rosato
Influences of various parameters on microparticles removal during laser surface cleaning
Y.F. Lu, Y.W. Zheng, L. Zhang, B. Luk’yanchuyk, W.D. Song and W.J. Wang
Particle removal with pulsed-laser induced plasma over an extended area of a silicon wafer
T. Hooper, Jr. and C. Cetinkaya
Particle removal by collisions with energetic clusters
J. Perel, J. Mahoney, P. Kopalidis and R. Becker
Biography
Kash L. Mittal






