Power Electronic Modules: Design and Manufacture, 1st Edition (Hardback) book cover

Power Electronic Modules

Design and Manufacture, 1st Edition

By William W. Sheng, Ronald P. Colino

CRC Press

296 pages | 49 B/W Illus.

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Hardback: 9780849322600
pub: 2004-09-29
$170.00
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pub: 2004-09-29
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Description

Designing and building power semiconductor modules requires a broad, interdisciplinary base of knowledge and experience, ranging from semiconductor materials and technologies, thermal management, and soldering to environmental constraints, inspection techniques, and statistical process control. This diversity poses a significant challenge to engineers, and a book that brings together the essential elements of these technologies is long overdue.

Power Electronic Modules: Design and Manufacture fills that void. It covers not only the basic technologies, but also the latest advances in these areas. Organized into three main sections, coverage begins with discussions on the materials used and their key properties, including a comparison of those properties with the requirements of high-performance, cost-effective power modules and the pros and cons of selected materials. The focus then shifts to manufacturing processes and quality control. The authors outline each key manufacturing operation and its corresponding inspection techniques and include two detailed manufacturing flow charts, one for the standard approach and one for a new all-solder approach. The final section of the book examines actual samples based on four different designs. The authors compare these samples in terms of thermal-electrical performance, thermal-mechanical performance, physical characteristics, and cost.

The growing importance of power modules has led to numerous but scattered journal and conference articles. Clearly written, authoritative, and well organized, this is a practical, up-to-date reference that forms a unique, one-stop handbook for their design and manufacture.

Table of Contents

Introduction

Selection Procedure

Materials

Insulating Substrate and Metallization

Base Plate

Bonding Material

Power Interconnection and Terminal

Encapsulant

Plastic Case and Cover

Manufacturing of Power IGBT Modules

Manufacturing Process

Process Control/Long-Term Reliability

Manufacturing Facilities

Manufacturing Flow Charts

Design

Thermal Management

Circuit Partitioning

Design Guidelines and Considerations

Thermal Results of Different Samples

Subject Categories

BISAC Subject Codes/Headings:
TEC008000
TECHNOLOGY & ENGINEERING / Electronics / General