Practical Guide for the Reliable Packaging of Electronics Thermal and Mechanical Design and Analysis

Preface

Author

1.      ISSUES IN ELECTRONICS PACKAGING DESIGN

a.      INTRODUCTION

b.      TECHNICAL MANAGEMENT ISSUES           

2.      BASIC HEAT TRANSFER: CONDUCTION, CONVECTION, AND RADIATION

a.      BASIC EQUATIONS AND CONCEPTS           

b.      GENERAL EQUATIONS    

c.      NON DIMENSIONAL GROUPS        

3.      CONDUCTIVE COOLING

a.      INTRODUCTION

b.      THERMAL RESISTANCE                 

c.      HEAT SPREADING            

d.      JUNCTION-TO-CASE RESISTANCE

e.      CONTACT INTERFACE RESISTANCE           

f.       2-D OR 3-D HEAT CONDUCTION   

4.      RADIATION COOLING

a.      INTRODUCTION

b.      FACTORS INFLUENCING RADIATION                       

c.      EXAMPLES AND ILLUSTRATIONS

d.      CABINET SURFACE TEMPERATURE           

e.      A FEW DESIGN TIPS

5.      FUNDAMENTALS OF CONVECTION COOLING

a.      INTRODUCTION 

b.      FREE (OR NATURAL) CONVECTION            

c.      FORCED CONVECTION    

d.      IN-DIRECT FLOW SYSTEM DESIGN             

6.      COMBINED MODES, TRANSIENT HEAT TRANSFER, AND ADVANCED MATERIALS

a.      INTRODUCTION

b.     COMBINED MODES

c.      TIME-DEPENDENT TEMPERATURE VARIATION       

d.      KEY ADVANCES IN MATERIALS AND TECHNOLOGIES

7.      BASICS OF VIBRATION AND ITS ISOLATION

a.      INTRODUCTION

b.      PERIODIC AND HARMONIC MOTIONS        

c.      FREE VIBRATION             

d.      FORCED VIBRATION       

e.      RANDOM VIBRATION

f.      VIBRATIONS AND MECHANICAL STRESSES DUE TO ACOUSTICS AND NOISE

g.      MULTIPLE DEGREE-OF-FREEDOM SYSTEMS

h.     VIBRATION ISOLATION MATERIALS AND TECHNIQUES

8.      BASICS OF SHOCK MANAGEMENT

a.      INTRODUCTION

b.      PULSE SHOCK ISOLATION

c.      VELOCITY SHOCK ISOLATION

9.      INDUCED STRESSES

a.      INTRODUCTION

b.      FORCED VIBRATION

c.      RANDOM VIBRATION

d.      SHOCK ENVIRONMENT

e.       

10.    ERROR PROOFING MEASUREMENTS

a.      INTRODUCTION

b.      TEST

c.     TESTS, EXPERIMENTS, AND MEASUREMENT ERRORS

11.    MECHANICAL AND THERMOMECHANICAL CONCERNS

a.      INTRODUCTION

b.      GENERAL STRESS-STRAIN RELATIONSHIP

c.      DETERMINING DEFORMATIONS UNDER APPLICATION OF GENERAL LOADS             

d.      THERMAL STRAINS AND STRESSES

e.      SIMPLIFICATIONS OR ENGINEERING ASSUMPTIONS

12.    ACOUSTICS

a.     INTRODUCTION

b.     NOISE, SOUND, AND THEIR DIFFERENCE

c.     GOVERNING EQUATIONS

d.     NOISE MEASUREMENT STANDARD

e.     ACOUSTICS AS A DESIGN PRIORITY

13.    MECHANICAL FAILURES AND RELIABILITY

a.      INTRODUCTION

b.      FAILURE MODES

c.      LIFE EXPECTANCY          

d.      DESIGN LIFE, RELIABILITY, AND FAILURE RATE    

14.    ELECTRICAL FAILURES AND RELIABILITY

a.      INTRODUCTION

b.      FAILURE MODES AND MECHANISMS

c.      LIFE EXPECTANCY OF ELECTRONICS

d.      DESIGN LIFE, RELAIBILITY, AND FAILURE RATE    

15.    CHEMICAL ATTACK FAILURES AND RELIABILITY

a.      INTRODUCTION

b.      ELECTROCHEMICAL ATTACKS

c.      MIGRATION AND ELECTROMIGRATION

16.    RELIABILITY MODELS, PREDICTIONS, AND CALCULATIONS

a.      INTRODUCTION

b.      BASIC DEFINITIONS

c.      RELIABILITY DISTRIBUTION MODELS

d.      DEVICE FAILURE RATE PREDICTIONS

e.      RELIABILITY MODELING

f.       RELIABILITY TESTING

g.      RELIABILITY TEST DESIGN

h.      FIELD FAILURE INVESTIGATION PROCESS

i.       COMMUNICATING RELIABILITY FINDINGS: CORE TEAM

17.    DESIGN CONSIDERATIONS IN AN AVIONICS ELECTRONIC PACKAGE

a.      INTRODUCTION

b.      DESIGN PARAMETERS

c.      ANALYSIS

APPENDIX A: DESCRIPTION OF FINITE ELEMENT MODEL

APPENDIX B: STANDARD ATMOSPHERE

APPENDIX C: TRANSIENT FLOW EMPERICAL FACTOR

APPENDIX D: IMPACT OF CONVECTION ON SPREAD ANGLE

APPENDIX E: HEAT TRANSFER COEFFICIENTS MODEL: NARROW GAP VERSUS WIDE GAP

APPENDIX F: CREEP

APPENDIX G: FATIGUE

REFERENCES

Biography

Dr. Jamnia has published four books with CRC Press, a large number of engineering papers and presentations as well as non-technical articles along with a number of patents. He has a demonstrated basic understanding of the engineering principles particularly in the areas of fluid flow, heat transfer and stress analysis. His primary expertise lies in electromechanical systems design and analysis particularly using numerical approximations and computer simulation. Currently, he heads design for reliability, compliance and safety activities for a medical device company.

His focus on the issues of electronics packaging began in the early 90s. And since 1995, he has been involved with the design and development of innovative electronics system particularly in the medical field. His prime achievement was the development of a specialized computer systems called the Learning Stationä to be used as teaching tool for individuals with cognitive delays and/or physical disabilities.

Dr. Jamnia enjoys teaching and interacting with others. In fact, Society for Automotive Engineers (SAE) had sponsored him for nearly ten years to teach workshops on electronics packaging form a thermal and mechanical design and analysis point of view.

"This book is intended for a hands-on engineer who needs back-of-the-envelope tools to develop design parameters and develop a means to conduct sanity checks. The true value of the book, however, is to raise the awareness of the design team on various aspects of the design that leads to developing a more reliable product."
—James Feine, President, USI Ultrasonic, Houston, Texas, USA