Practical Guide to the Packaging of Electronics Thermal and Mechanical Design and Analysis, Third Edition

Introduction
Issues in Electronics Packaging Design
Technical Management Issues

Basic Heat Transfer—Conduction, Convection, and Radiation
Basic Equations and Concepts
General Equations
Nondimensional Groups

Conductive Cooling
Introduction
Thermal Resistance
Heat Spreading
Junction-to-Case Resistance
Contact Interface Resistance
2D or 3D Heat Conduction

Radiation Cooling
Introduction
Factors Influencing Radiation
Examples and Illustrations
Cabinet Surface Temperature
A Few Design Tips

Fundamentals of Convection Cooling
Introduction
Free (or Natural) Convection
Fin Design
Forced Convection
Indirect Flow System Design

Combined Modes, Transient Heat Transfer, and Advanced
Materials
Introduction
Total System Resistance
Time-Dependent Temperature Variation
Advanced Materials and Technologies

Basics of Vibration and Its Isolation
Introduction
Periodic and Harmonic Motions
Free Vibration
Forced Vibration
Random Vibration
Vibrations and Mechanical Stresses Caused by Acoustics and Noise
Multiple DOF Systems
A Few Words on Advanced and Active Isolation Techniques

Basics of Shock Management
Introduction
Pulse Shock Isolation
Velocity Shock Isolation

Induced Stresses
Introduction
Forced Vibration
Random Vibration
Shock Environment

The Finite Element Methods
Introduction
Some Basic Definitions
The FEA Procedure
Finite Element Formulation
Formulation of Characteristic Matrix and Load Vector
Finite Element Formulation of Dynamic Problems
Finite Element Formulation of Heat Conduction
CAD to FEA Considerations
Criteria for Choosing Engineering Software
Summary

Mechanical and Thermomechanical Concerns
Introduction
General Stress–Strain Relationship
Determining Deformations under Application of General Loads
Thermal Strains and Stresses
Thermal Strains and Deflections
Simplifications (or Making Engineering Assumptions)

Acoustics
Introduction
Noise, Sound, and Their Difference
Governing Equations
Measurement and Standards
Acoustics as a Design Priority

Mechanical Failures and Reliability
Introduction
Failure Modes
Life Expectancy
Design Life, Reliability, and Failure Rate

Electrical Failures and Reliability
Introduction
Failure Modes and Mechanism
Life Expectancy of Electronics Assemblies
Design Life, Reliability, and Failure Rate

Chemical Attack Failures and Reliability Concerns
Introduction
Electrochemical Attacks
Migration and Electromigration

Reliability Models, Predictions, and Calculations
Introduction
Basic Definitions
Reliability Models
Device Failure Rate Prediction
System Failure Rate
Reliability Testing

Design Considerations in an Avionics Electronic Package
Introduction
Design Parameters
Analysis
Acknowledgment

Appendices

References

Biography

Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations. Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning Station^TM - used as a teaching tool for individuals with cognitive disabilities.

"This book is intended for a hands-on engineer who needs back-of-the-envelope tools to develop design parameters and develop a means to conduct sanity checks. The true value of the book, however, is to raise the awareness of the design team on various aspects of the design that leads to developing a more reliable product."
—James Feine, President, USI Ultrasonic, Houston, Texas, USA