1st Edition

RF and Microwave Passive and Active Technologies

Edited By Mike Golio, Janet Golio Copyright 2007
    732 Pages 100 B/W Illustrations
    by CRC Press

    In the high frequency world, the passive technologies required to realize RF and microwave functionality present distinctive challenges. SAW filters, dielectric resonators, MEMS, and waveguide do not have counterparts in the low frequency or digital environment. Even when conventional lumped components can be used in high frequency applications, their behavior does not resemble that observed at lower frequencies. RF and Microwave Passive and Active Technologies provides detailed information about a wide range of component technologies used in modern RF and microwave systems.

    Updated chapters include new material on such technologies as MEMS, device packaging, surface acoustic wave (SAW) filters, bipolar junction and heterojunction transistors, and high mobility electron transistors (HMETs). The book also features a completely rewritten section on wide bandgap transistors.

    Introduction, P. Fay
    Microwave and RF Engineering, M. Golio

    Passive Technologies

    Passive Lumped Components, A. Riddle
    Passive Microwave Devices, M.B. Steer
    Dielectric Resonators, S.J. Fiedziuszko
    RF MEMS, K.R. Varian
    Surface Acoustic Wave (SAW) Filters, D.C. Malocha
    RF Coaxial Cables, M.E. Majerus
    Coaxial Connectors, D. Anderson
    Antenna Technology, J.B. West
    Phased Array Antenna Technology, J.B. West
    The Fresnel Zone Plate Antenna, J.C. Wiltse
    RF Package Design and Development, J.S. Pavio

    Active Device Technologies

    Varactors, J. Stake
    Schottky Diode Frequency Multipliers, J.R. East and I. Mehdi
    Transit Time Microwave Devices Transistors, R.J. Trew
    Bipolar Junction Transistors (BJTs), J.C. Cowles
    Heterostructure Bipolar Transistors (HBTs), W. Liu
    Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs), J. Costa,M. Carroll, A. Rezvani, and T. Mckay
    RFCMOS Modeling & Circuit Applications, J. Costa,M. Carroll, A. Rezvani, and T. Mckay
    Metal Semiconductor Field Effect Transistors (MESFETs), M.S. Shur
    High Electron Mobility Transistors (HEMTs), Mishra, Chavarkar
    Nitride Devices, R.J. Trew
    Microwave Power Tubes, J.C. Whitaker
    Monolithic Microwave IC Technology, L.P. Dunleavy
    RF IC design tradeoffs (Bringing RFICs to the Market), J.C. Cowles

    Materials Properties

    Metals, M. Golio
    Dielectrics, K.F. Etzold
    Ferroelectrics and Piezoelectrics, K.F. Etzold
    Material Properties of Semiconductors, H.M. Harris
    Appendix A: Mathematics, Symbols, and Physical Constants
    Appendix B: Microwave Engineering Appendix, J.P. Wendler


    Mike Golio (HVVi Semiconductors, Inc., Phoenix, Arizona, USA) (Author), Janet Golio (Edited by)