1st Edition
Self-Organized 3D Integrated Optical Interconnects with All-Photolithographic Heterogeneous Integration
1. Introduction 2. Guidelines toward Self-Organized 3D Integrated Optical Interconnects 3. Scalable Film Optical Link Modules (S-FOLMs) 4. Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits 5. Resource Saving All-Photolithographic Heterogeneous Integration: PL-Pack with SORT 6. High-Speed/Small-Size Light Modulators and Optical Switches 7. Self-Organized Lightwave Networks (SOLNETs) 8. Self-Organized 3D Integrated Optical Interconnects: Model Proposals 9. Self-Organized 3D Micro Optical Switching Systems (3D-MOSS): Model Proposals and Predicted Performance 10. Film-Based Integrated Solar Energy Conversion Systems 11. Embodiments Disclosed in Patents 12. Future Challenges
Biography
Tetsuzo Yoshimura is currently a professor emeritus at Tokyo University of Technology.
"The book describes 3D optical interconnects intended for high-performance chip and board-level communications.
In the first three chapters, it presents the fundamentals and challenges of optical interconnection and the strategies for scaling at the chip and module level. It then covers, in three chapters, the fundamentals of heterogeneous integrated photonics technologies pioneered by the author's research. The final three chapters, in a hundred pages, treat self-organized lightwave networks—or SOLNET—and develop in detail the technologies for fabrication of the interconnect along with modeling, computer simulation of the performances and experimental validation.
The book is stimulating for a variety of readers—scientists, engineers and students—and will be a useful reference for further research and development in the nascent field of optical interconnections."
Silvano Donati, University of Pavia, Italy
