Semiconductor Devices in Harsh Conditions: 1st Edition (e-Book) book cover

Semiconductor Devices in Harsh Conditions

1st Edition

Edited by Kirsten Weide-Zaage, Malgorzata Chrzanowska-Jeske

CRC Press

234 pages | 66 Color Illus. | 55 B/W Illus.

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Description

This book introduces the reader to a number of challenges for the operation of electronic devices in various harsh environmental conditions. While some chapters focus on measuring and understanding the effects of these environments on electronic components, many also propose design solutions, whether in choice of material, innovative structures, or strategies for amelioration and repair. Many applications need electronics designed to operate in harsh environments. Readers will find, in this collection of topics, tools and ideas useful in their own pursuits and of interest to their intellectual curiosity.

With a focus on radiation, operating conditions, sensor systems, package, and system design, the book is divided into three parts. The first part deals with sensing devices designed for operating in the presence of radiation, commercials of the shelf (COTS) products for space computing, and influences of single event upset. The second covers system and package design for harsh operating conditions. The third presents devices for biomedical applications under moisture and temperature loads in the frame of sensor systems and operating conditions.

Reviews

"Engineers are developing electronic systems for applications in environments significantly more taxing than those seen in classical computing applications. This book exposes engineers to the range of challenges faced and fosters an understanding of the approaches useful to succeed in those taxing application environments. It has an outstanding overview of the challenges to design electronic systems to operate in the presence of hazards in extreme environments."

—Klaus Schuegraf, Cymer, San Diego, California, USA

Table of Contents

Contents

Foreword…………………………………………………………………………………………………. vii

Preface………………………………………………………………………………………………………..ix

Editors……………………………………………………………………………………………………….xv

Contributors…………………………………………………………………………………………… xvii

Section I Radiation

1. Commercial Off-the-Shelf Components in Space Applications…………3

Stefano Esposito and Massimo Violante

2. Soft Errors in Digital Circuits Subjected to Natural Radiation: Characterisation, Modelling and Simulation Issues……………………….. 21

Daniela Munteanu and Jean-Luc Autran

3. Simulation of Single-Event Effects on Fully Depleted Siliconon- Insulator (FDSOI) CMOS…………………………………………………………….43

Walter Calienes Bartra, Andreas Vladimirescu and Ricardo Reis

Section II Sensors and Operating Conditions

4. Electronic Sensors for the Detection of Ovarian Cancer…………………. 69

A. M. Whited and Raj Solanki

5. Sensors and Sensor Systems for Harsh Environment Applications…………………………………………………………….87

Andrea De Luca, Florin Udrea, Guoli Li, Yun Zeng, Nicolas André, Guillaume Pollissard-Quatremère, Laurent A. Francis, Denis Flandre, Zoltan Racz, Julian W. Gardner, Shan Zee Ali, Octavian Buiu, Bogdan C. Serban, Cornel Cobianu and Tracy Wotherspoon

6. III-Nitride Electronic Devices for Harsh Environments………………… 111

Shyh-Chiang Shen

Section III Packaging and System Design

7. Packaging for Systems in Harsh Environments…………………………….. 135

Marc Christopher Wurz and Susanne Bengsch

8. Corrosion Resistance of Lead-Free Solders under Environmental Stress……………………………………………………………………… 149

Suhana Mohd Said and Nor Ilyana Muhd Nordin

9. From Deep Submicron Degradation Effects to Harsh Operating Environments: A Self-Healing Calibration Methodology for Performance and Reliability Enhancement……………………………………. 167

Eric J. Wyers and Paul D. Franzon

10. Role of Diffusional Interfacial Sliding during Temperature Cycling and Electromigration-Induced Motion of Copper Through Silicon Via………………………………………………………………………… 197

Lutz Meinshausen, Ming Liu, Indranath Dutta, Tae-Kyu Lee and Li Li

About the Editors

Malgorzata Chrzanowska-Jeske is a professor of electrical and computer engineering, and the director of the VLSI & Emerging Technology Design Automation Laboratory at Portland State University, Oregon. She joined the Electrical and Computer Engineering Department at Portland State University in 1989 and was Department Chair from 2004 to 2010. Previously, she served on the faculty of the Technical University of Warsaw, Poland, and as a design automation specialist at the Research and Production Center of Semiconductor Devices in Warsaw, Poland. She holds an MS degree in electronics engineering from the Technical University of Warsaw and a PhD degree in electrical engineering from Auburn University, Alabama. Her research interests include computer-aided design for very large-scale integration circuits, MS-SOCs, three dimensional integrated circuits, nanotechnology, design for manufacturing, and design issues in emerging technologies. Dr. Chrzanowska-Jeske has presented tutorial, keynote and invited talks at various international conferences and events and published more than 150 technical papers. She serves as a panelist and reviewer for the National Science Foundation and as a reviewer for the National Research Council Canada and many international journals and conferences. Her research has been supported by the National Science Foundation and industry.

Dr. Chrzanowska-Jeske has served in various roles on the technical, steering and organizing committees of many international conferences and workshops, and as senior editor, associate editor and guest editor of international journals. From 2008 to 2013, she served two terms on the Board of Governors of the Institute of Electrical and Electronics Engineers (IEEE) Circuits and Systems Society, where she was also the chair of the Distinguished Lecturer Program, the chair and founding member of Women in Circuits and Systems, and a representative for Regions 1–7 on the Circuits and Systems Society Board of Governors. Currently, she serves as vice president for technical activities for the IEEE Nanotechnology Council. She received the Best Paper Award from IEEE Alabama Section for the best IEEE Transactions paper in 1990, a 1995 Design Automation Conference Scholarship Award, and from IEEE Council on Electronic Design Automation, the 2008 Donald O. Pederson Best Paper Award in IEEE Transactions on Computer-Aided- Design of Integrated Circuits and Systems.

Kirsten Weide-Zaage is privatdozent (senior lecturer) in the field of microelectronics on the faculty of electrical engineering and computer science at the Gottfried Wilhelm Leibniz Universität in Hannover, Germany. She studied physics with a focus on biophysics, and received her PhD in electrical engineering in the field of migration effects in interconnects. In 2011, she completed her habilitation in the field of microelectronics on the simulation of failure mechanisms in chips and packaging. Since 1988, she has been working on the faculty of electrical engineering and computer science. From 1991 to 2014, Dr. Weide-Zaage was with the Information Technology Laboratory as a researcher and leader of the simulation group ‘Robust Electronics’, working in the field of interconnect and package reliability. In 2015, she moved with her renamed group, ‘Reliability: Simulation and Risk Analysis’, to the Institute of Microelectronic Systems. Her main research activities are in the field of thermal-electrical-mechanical static and dynamic simulation of microelectronic reliability. These research activities focus on diffusion processes like migration effects in interconnects, contacts, traces as well as solder, the growth of intermetallic compounds, corrosion and package simulation in terms of optimization. Another topic of the group is technology computer-aided design simulation of the behavior of transistor cells in terms of processing, mechanical stress, temperature and radiation.

Dr. Weide-Zaage has served in various roles on the technical, steering and organizing committees of international and national conferences and workshops. She is author of a book and more than 100 scientific articles, including journal and conference publications, invited papers and book chapters. In 2010, she received a best paper award from the European Symposium on Reliability of Electron Devices.

About the Series

Devices, Circuits, and Systems

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Subject Categories

BISAC Subject Codes/Headings:
TEC008000
TECHNOLOGY & ENGINEERING / Electronics / General
TEC008010
TECHNOLOGY & ENGINEERING / Electronics / Circuits / General
TEC009070
TECHNOLOGY & ENGINEERING / Mechanical