638 Pages
by
CRC Press
640 Pages
by
CRC Press
Also available as eBook on:
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.
The Electronic Packaging Handbook, a new volume in the... Read more
Fundamentals of the Design Process
Surface Mount Technology
Integrated Circuit Packages
Direct Chip Attach
Circuit Boards
EMC and PCB Design
Hybrid Assemblies
Interconnects
Design for Test
Adhesive and Its Application
Thermal Management
Testing
Inspection
Package/Enclosure
Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach
Product Safety and Third-Party Certification
Appendix A: Definitions
Index
Surface Mount Technology
Integrated Circuit Packages
Direct Chip Attach
Circuit Boards
EMC and PCB Design
Hybrid Assemblies
Interconnects
Design for Test
Adhesive and Its Application
Thermal Management
Testing
Inspection
Package/Enclosure
Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach
Product Safety and Third-Party Certification
Appendix A: Definitions
Index
Biography
Glenn R. Blackwell
"…highly recommended…enough detail…provides essential factural information on the design, manufacturing, and testing of electronic devices and systems…this book is primarily for engineers and technicians involved in any aspect of design, production, testing, or packaging of electronic products…The book ties together well with references between chapters…well written and edited…each chapter includes a section of bibliographic references and suggested readings."
--Dave Fish, Pandion Electronics, Inc., SMTnet.com
