The Electronic Packaging Handbook: 1st Edition (Hardback) book cover

The Electronic Packaging Handbook

1st Edition

Edited by Glenn R. Blackwell

CRC Press

640 pages

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Hardback: 9780849385919
pub: 1999-11-29
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pub: 2017-12-19
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Description

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.

The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.

Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.

Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Reviews

"…highly recommended…enough detail…provides essential factural information on the design, manufacturing, and testing of electronic devices and systems…this book is primarily for engineers and technicians involved in any aspect of design, production, testing, or packaging of electronic products…The book ties together well with references between chapters…well written and edited…each chapter includes a section of bibliographic references and suggested readings."

--Dave Fish, Pandion Electronics, Inc., SMTnet.com

Table of Contents

Fundamentals of the Design Process

Surface Mount Technology

Integrated Circuit Packages

Direct Chip Attach

Circuit Boards

EMC and PCB Design

Hybrid Assemblies

Interconnects

Design for Test

Adhesive and Its Application

Thermal Management

Testing

Inspection

Package/Enclosure

Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach

Product Safety and Third-Party Certification

Appendix A: Definitions

Index

About the Series

Electronics Handbook Series

Learn more…

Subject Categories

BISAC Subject Codes/Headings:
TEC008000
TECHNOLOGY & ENGINEERING / Electronics / General