Thermal Design of Electronic Equipment: 1st Edition (Hardback) book cover

Thermal Design of Electronic Equipment

1st Edition

By Ralph Remsburg

CRC Press

400 pages

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Hardback: 9780849300820
pub: 2000-09-27
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pub: 2017-12-19
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In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible.

Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

Table of Contents


Nomenclature and Symbology

Unit Conversion Factors

Introduction to Formulas for Thermal Design of Electronic Equipment

Introduction to the Modes of Heat Transfer in Electronic Equipment

Theoretical Power Dissipation in Electronic Components

Thermal Engineering Software for Personal Computers

Formulas for Conduction Heat Transfer in Electronic Equipment

Thermal Conductivity

Conduction - Steady State

Conduction - Transient

Boundary Conditions

Conduction in Extended Surfaces

Thermal Contact Resistance in Electronic Equipment Interfaces

Discrete Heat Sources and Thermal Spreading

Formulas for Fluid Dynamics for Electronic Equipment

Hydrodynamic Properties of Fluids

Fluid Statics

Fluid Dynamics

Incompressible Ideal Fluid Flow

Incompressible Real Fluid Flow

Loss Coefficients and Dynamic Drag

Fans and Pumps

Electronic Chassis Flow

Convection Heat Transfer in Electronic Equipment

Fluid Properties

Boundary Layer Theory

Dimensionless Groups

Forced Convection

Natural Convection

Radiation Heat Transfer in Electronic Equipment

Radiation Equations

Surface Characteristics

View Factors

Environmental Effects

Heat Transfer with Phase Change

Dimensionless Parameters in Boiling and Condensation

Modes of Boiling Liquids



Melting and Freezing

Combined Modes of Heat Transfer for Electronic Equipment

Conduction in Series and Parallel

Conduction and Convection in Series

Radiation and Convection in Parallel

Overall Heat Transfer Coefficient

Appendix: Thermophysical Properties of Materials

NOTE: References at the end of Chapters 1-6; Introduction at the beginning of Chapters 2-7

About the Series

Electronics Handbook Series

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Subject Categories

BISAC Subject Codes/Headings:
TECHNOLOGY & ENGINEERING / Electronics / General