1st Edition

Tribology In Chemical-Mechanical Planarization

By Hong Liang, David Craven Copyright 2005
200 Pages
by CRC Press

200 Pages
by CRC Press

200 Pages
by CRC Press

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as... Read more
Introduction, Surface Properties, Friction, Lubrication, Wear In CMP, Force Transmission, CMP Pads, Post-CMP Cleaning

Biography

Liang, Hong; Craven, David