xing-chang  wei Author of Evaluating Organization Development
FEATURED AUTHOR

xing-chang wei

Professor
Zhejiang University

Xing-Chang Wei (M’01–SM’09) received the Ph.D. degree from Xidian University, China, in 2001. From 2001 to 2010, he was with the A*STAR-IHPC , Singapore, as the Research Scientist. In 2010, he joined Zhejiang University, China, as a Full Professor. He has authored more than 50 papers. His main research interests include PI, SI, and EMI analysis. He received the 2007 Singapore IES Engineering Achievement Award and 2009 China NCET Award. He was the Co-TPC Chair of 2010 EDAPS conference.

Biography

Xing-Chang Wei received the Ph. D degree in electrical engineering from the Xi’an University of Electronic Science and Technology, China, in 2001. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He received the 2007 Singapore Institution of Engineers Prestigious Engineering Achievement Award for his contribution on the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010, he joined Zhejiang University, Hangzhou, China, as a Full Professor, and received the New Century Excellent Talents Award from China Ministry of Education.

Areas of Research / Professional Expertise

    His main research interests include power integrity (PI), signal integrity (SI), and electromagnetic interference (EMI) simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experiences of the EMC modeling and design of the high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area. He proposed the integral equation methods for the efficient simulation of power/ground planes in high-speed printed circuit boards, and this work was honoured with the Best Symposium Paper Award in 2012 Asia-Pacific Symposium on Electromagnetic Compatibility and FY09 Best Paper Award of Institute of High Performance Computing, Singapore. His another work about the cylindrical waves modeling of through interposer vias achieves the Outstanding Paper Award on 15th International Conference on Electronics Packaging Technology.  Currently he is teaching the graduated course “Electromagnetic Compatibility: Principles and Designs for High-Speed Circuits” in Zhejiang University, China.
    He is very active in the electromagnetic compatibility research area. He was the Co-Chair of the Technical Program Committee of the 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, and severed as the TPC member and Program Chair of 2010, 2011, 2012 and 2013 Asia-Pacific Symposium on Electromagnetic Compatibility respectively. He also delivered many workshops about signal integrity, power integrity and EMC of high-speed circuits on 2011- 2017  Asia-Pacific Symposium on Electromagnetic Compatibility and other Universities.
    He had finished/conducted several related projects, including “Signal integrity and power integrity analysis of high-speed integrated circuits” supported by Singapore government, “High frequency electromagnetic modeling and optimization of TSV-based 3D integration” supported by National Natural Science Foundation of China, “EM analysis of TSV-based 3D interposer” supported by Zhejiang Province Natural Science Foundation of China, and so on. He also had some industrial projects with Huawei Company in China to solve their practical EMC problems in their high-speed IT products.

Books

Featured Title
 Featured Title - Modeling and Design of Electromagnetic Compatibility - 1st Edition book cover

Articles

D. Yi, X. C. Wei, Y. L. Xu

A Transparent microwave absorber based on patterned graphene: design, measuremen


Published: Mar 28, 2017 by D. Yi, X. C. Wei, Y. L. Xu
Authors: IEEE Trans. Nanotechnol.
Subjects: Engineering - Electrical

A patterned graphene-based transparent microwave absorber is proposed. Graphene is transferred onto polyethylene terephthalate (PET) film, and patterned as μm-level periodic patches, so that a capacitive and resistive graphene surface is obtained at microwave band. The optical transmittance of the fabricated graphene/PET film reaches around 80% in the whole optical light range, while the absorption coefficient reaches 90% at 12.6 GHz. 100% absorption and 3 GHz bandwidth broadening are realized.

IEEE Trans. Microwave Theory Techn.

Tunable microwave absorber based on patterned graphene


Published: Mar 24, 2017 by IEEE Trans. Microwave Theory Techn.
Authors: D. Yi, X. C. Wei, Y. L. Xu
Subjects: Engineering - Electrical

Two approaches to realize a tunable absorber based on patterned graphene metasurface are proposed in this paper. In the first approach, the center frequency of the absorber can be tuned by the surface resistance of the graphene in a wide range. The second approach, by implying the stack of graphene as the absorbing layer, can introduce a remarkable shift of the center frequency. A good correlation between simulation and measurement results is obtained.

IEEE Trans. Electromagn. Compat.

A Closed-form solution for the impedance calculation of grid power distribution


Published: Mar 09, 2017 by IEEE Trans. Electromagn. Compat.
Authors: W. Y. Ding, X. C. Wei, D. Yi, and Y. F. Shu
Subjects: Engineering - Electrical

In this paper, we propose a closed-form solution for the impedance calculation of grid power distribution network (PDN). The grid PDN is equivalent to a plane PDN, whose impedance o can be calculated by the closed-form method. The results obtained by the proposed method show good agreements with that obtained by 3-D full-wave simulation and measurement.

IEEE Trans. Antennas Propagat.

A bandpass frequency selective surface with a low cross-polarization based on ca


Published: Dec 01, 2016 by IEEE Trans. Antennas Propagat.
Authors: L. L. Yang, X. C. Wei, D. Yi, and J. M. Jin
Subjects: Engineering - Electrical

A novel low cross-polarization bandpass frequency selective surface (FSS) with low passband ripples and a steep roll-off at both sides of the passband is proposed. The proposed FSS unit cell is composed of two specially designed cavities with mixed electrically and magnetically conducting boundaries. The characteristics, including a steep roll-off, low passband ripples, a low cross-polarization, and stability at oblique incidence angles, are verified by the measurement.

IEEE Trans. Electromagn. Compat.

A novel coplanar common-mode filter with a wide stopband


Published: Sep 22, 2016 by IEEE Trans. Electromagn. Compat.
Authors: J. B. Zhang, X. C. Wei, Y. F. Shu, X. Q. Yu, and Y. L. Xu
Subjects: Engineering - Electrical

To compensate the stopband offset, in this paper, a general method for expanding the bandwidth of a CMF is proposed. A wideband CMF with a central frequency around 25 GHz and an all-pass performance (from DC to 40 GHz) for differential signals is designed. Both the simulation and measurement results verify the effectiveness of the proposed improved CMF. The -10 dB stopband bandwidth of the coplanar CMF is increased by five times without SI problems.

IEEE Transactions on Components, Packaging and Manufacturing Technology

Accurate Field-Circuit Hybrid Modeling of High Density Through Glass Via Arrays


Published: Dec 18, 2015 by IEEE Transactions on Components, Packaging and Manufacturing Technology
Authors: J. Li, X. C. Wei, and E. P. Li
Subjects: Engineering - Electrical

In this paper, an accurate wideband modeling approach based on a cylindrical mode expansion of electromagnetic filed around perfect magnetic conductors (PMCs) is proposed to analyze the electrical properties of high-density through glass via (TGV) arrays. The accuracy and the efficiency of the proposed field-circuit hybrid method are fully validated by comparing it with 2-D quasi-static, 3-D full-wave simulations, and published measurement results.

IEEE Trans. Electromagn. Compat.

A particle swarm optimization-based approach for predicting maximum radiated emi


Published: Sep 04, 2015 by IEEE Trans. Electromagn. Compat.
Authors: F. P. Xiang, E. P. Li, X. C. Wei, and J. M. Jin
Subjects: Engineering - Electrical

In this paper, an approach is proposed to predict the maximum far-field radiated emission based on phaseless near-field scanning. The maximum radiated emission from printed circuit boards is assumed to be produced by dominant magnetic dipoles located by the near-field measurement. The particle swarm optimization technique is then employed to identify the complex moment components of the dipoles.

IEEE Trans. Electromagn. Compat.

A compact meander line-resonator hybrid structure for wideband common mode suppr


Published: May 18, 2015 by IEEE Trans. Electromagn. Compat.
Authors: Y. F. Shu, X. C. Wei, X. Q. Yu, Y. S. Li, and E. P. Li
Subjects: Engineering - Electrical

In this paper, a novel compact and wideband common-mode suppression structure is proposed, which is composed of a meander line and several quarter wavelength resonators. A reduction of 15 dB of common-mode propagation above 0.8 GHz is obtained by using the proposed hybrid structure. The measurement results of printed circuit boards, which are designed and fabricated on the simulation model, show good correlation with the simulation results.

J.  Electromagn. Waves Appl

A hybrid domain decomposition and optimization method for predicting electromagn


Published: Apr 04, 2015 by J. Electromagn. Waves Appl
Authors: F. P. Xiang, X. C. Wei, and E. P. Li
Subjects: Engineering - Electrical

Electromagnetic emission characterization of printed circuit boards (PCBs) based on phaseless near-field measurement is increasingly concerned. Generally, the PCB is modelled by equivalent elemental dipoles. To accurately model the PCB, enough dipoles are required and consequently an inevitable trade-off occurs between the modelling accuracy and the model retrieval efficiency. To deal with this issue, an efficient hybrid method is here proposed.

IEEE Trans. Electromagn. Compat.

PDN impedance modeling for multiple through vias array in doped silicon


Published: Apr 07, 2014 by IEEE Trans. Electromagn. Compat.
Authors: G. X. Luo, E. P. Li, X. C. Wei, X. Cui, and R. Hao
Subjects: Engineering - Electrical

The power distribution network (PDN) impedance of 3-D-through silicon vias (TSVs) interposer layer is modeled by considering the metal-oxide-semiconductor (MOS) structure effects. The PDN impedance characteristics of the 3-D-IC integrated system with multiple TSVs are performed by using the proposed multitransmission line and model reduction methods, and the importance of the capacitance is presented.