xing-chang  wei Author of Evaluating Organization Development
FEATURED AUTHOR

xing-chang wei

Professor
Zhejiang University

Xing-Chang Wei (M’01–SM’09) received the Ph.D. degree from Xidian University, China, in 2001. From 2001 to 2010, he was with the A*STAR-IHPC , Singapore, as the Research Scientist. In 2010, he joined Zhejiang University, China, as a Full Professor. He has authored more than 50 papers. His main research interests include PI, SI, and EMI analysis. He received the 2007 Singapore IES Engineering Achievement Award and 2009 China NCET Award. He was the Co-TPC Chair of 2010 EDAPS conference.

Biography

Xing-Chang Wei received the Ph. D degree in electrical engineering from the Xi’an University of Electronic Science and Technology, China, in 2001. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He received the 2007 Singapore Institution of Engineers Prestigious Engineering Achievement Award for his contribution on the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010, he joined Zhejiang University, Hangzhou, China, as a Full Professor, and received the New Century Excellent Talents Award from China Ministry of Education.

Areas of Research / Professional Expertise

    His main research interests include power integrity (PI), signal integrity (SI), and electromagnetic interference (EMI) simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experiences of the EMC modeling and design of the high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area. He proposed the integral equation methods for the efficient simulation of power/ground planes in high-speed printed circuit boards, and this work was honoured with the Best Symposium Paper Award in 2012 Asia-Pacific Symposium on Electromagnetic Compatibility and FY09 Best Paper Award of Institute of High Performance Computing, Singapore. His another work about the cylindrical waves modeling of through interposer vias achieves the Outstanding Paper Award on 15th International Conference on Electronics Packaging Technology.  Currently he is teaching the graduated course “Electromagnetic Compatibility: Principles and Designs for High-Speed Circuits” in Zhejiang University, China.
    He is very active in the electromagnetic compatibility research area. He was the Co-Chair of the Technical Program Committee of the 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, and severed as the TPC member and Program Chair of 2010, 2011, 2012 and 2013 Asia-Pacific Symposium on Electromagnetic Compatibility respectively. He also delivered many workshops about signal integrity, power integrity and EMC of high-speed circuits on 2011- 2017  Asia-Pacific Symposium on Electromagnetic Compatibility and other Universities.
    He had finished/conducted several related projects, including “Signal integrity and power integrity analysis of high-speed integrated circuits” supported by Singapore government, “High frequency electromagnetic modeling and optimization of TSV-based 3D integration” supported by National Natural Science Foundation of China, “EM analysis of TSV-based 3D interposer” supported by Zhejiang Province Natural Science Foundation of China, and so on. He also had some industrial projects with Huawei Company in China to solve their practical EMC problems in their high-speed IT products.

Books

Featured Title
 Featured Title - Modeling and Design of Electromagnetic Compatibility - 1st Edition book cover

Articles

D. Yi, X. C. Wei, Y. L. Xu

A Transparent microwave absorber based on patterned graphene: design, measuremen


Published: Mar 28, 2017 by D. Yi, X. C. Wei, Y. L. Xu
Authors: IEEE Trans. Nanotechnol.
Subjects: Engineering - Electrical

A patterned graphene-based transparent microwave absorber is proposed. Graphene is transferred onto polyethylene terephthalate (PET) film, and patterned as μm-level periodic patches, so that a capacitive and resistive graphene surface is obtained at microwave band. The optical transmittance of the fabricated graphene/PET film reaches around 80% in the whole optical light range, while the absorption coefficient reaches 90% at 12.6 GHz. 100% absorption and 3 GHz bandwidth broadening are realized.

IEEE Trans. Microwave Theory Techn.

Tunable microwave absorber based on patterned graphene


Published: Mar 24, 2017 by IEEE Trans. Microwave Theory Techn.
Authors: D. Yi, X. C. Wei, Y. L. Xu
Subjects: Engineering - Electrical

Two approaches to realize a tunable absorber based on patterned graphene metasurface are proposed in this paper. In the first approach, the center frequency of the absorber can be tuned by the surface resistance of the graphene in a wide range. The second approach, by implying the stack of graphene as the absorbing layer, can introduce a remarkable shift of the center frequency. A good correlation between simulation and measurement results is obtained.

IEEE Trans. Electromagn. Compat.

A Closed-form solution for the impedance calculation of grid power distribution


Published: Mar 09, 2017 by IEEE Trans. Electromagn. Compat.
Authors: W. Y. Ding, X. C. Wei, D. Yi, and Y. F. Shu
Subjects: Engineering - Electrical

In this paper, we propose a closed-form solution for the impedance calculation of grid power distribution network (PDN). The grid PDN is equivalent to a plane PDN, whose impedance o can be calculated by the closed-form method. The results obtained by the proposed method show good agreements with that obtained by 3-D full-wave simulation and measurement.

IEEE Trans. Antennas Propagat.

A bandpass frequency selective surface with a low cross-polarization based on ca


Published: Dec 01, 2016 by IEEE Trans. Antennas Propagat.
Authors: L. L. Yang, X. C. Wei, D. Yi, and J. M. Jin
Subjects: Engineering - Electrical

A novel low cross-polarization bandpass frequency selective surface (FSS) with low passband ripples and a steep roll-off at both sides of the passband is proposed. The proposed FSS unit cell is composed of two specially designed cavities with mixed electrically and magnetically conducting boundaries. The characteristics, including a steep roll-off, low passband ripples, a low cross-polarization, and stability at oblique incidence angles, are verified by the measurement.

IEEE Trans. Electromagn. Compat.

A novel coplanar common-mode filter with a wide stopband


Published: Sep 22, 2016 by IEEE Trans. Electromagn. Compat.
Authors: J. B. Zhang, X. C. Wei, Y. F. Shu, X. Q. Yu, and Y. L. Xu
Subjects: Engineering - Electrical

To compensate the stopband offset, in this paper, a general method for expanding the bandwidth of a CMF is proposed. A wideband CMF with a central frequency around 25 GHz and an all-pass performance (from DC to 40 GHz) for differential signals is designed. Both the simulation and measurement results verify the effectiveness of the proposed improved CMF. The -10 dB stopband bandwidth of the coplanar CMF is increased by five times without SI problems.

IEEE Transactions on Components, Packaging and Manufacturing Technology

Accurate Field-Circuit Hybrid Modeling of High Density Through Glass Via Arrays


Published: Dec 18, 2015 by IEEE Transactions on Components, Packaging and Manufacturing Technology
Authors: J. Li, X. C. Wei, and E. P. Li
Subjects: Engineering - Electrical

In this paper, an accurate wideband modeling approach based on a cylindrical mode expansion of electromagnetic filed around perfect magnetic conductors (PMCs) is proposed to analyze the electrical properties of high-density through glass via (TGV) arrays. The accuracy and the efficiency of the proposed field-circuit hybrid method are fully validated by comparing it with 2-D quasi-static, 3-D full-wave simulations, and published measurement results.

IEEE Trans. Electromagn. Compat.

A particle swarm optimization-based approach for predicting maximum radiated emi


Published: Sep 04, 2015 by IEEE Trans. Electromagn. Compat.
Authors: F. P. Xiang, E. P. Li, X. C. Wei, and J. M. Jin
Subjects: Engineering - Electrical

In this paper, an approach is proposed to predict the maximum far-field radiated emission based on phaseless near-field scanning. The maximum radiated emission from printed circuit boards is assumed to be produced by dominant magnetic dipoles located by the near-field measurement. The particle swarm optimization technique is then employed to identify the complex moment components of the dipoles.

IEEE Trans. Electromagn. Compat.

A compact meander line-resonator hybrid structure for wideband common mode suppr


Published: May 18, 2015 by IEEE Trans. Electromagn. Compat.
Authors: Y. F. Shu, X. C. Wei, X. Q. Yu, Y. S. Li, and E. P. Li
Subjects: Engineering - Electrical

In this paper, a novel compact and wideband common-mode suppression structure is proposed, which is composed of a meander line and several quarter wavelength resonators. A reduction of 15 dB of common-mode propagation above 0.8 GHz is obtained by using the proposed hybrid structure. The measurement results of printed circuit boards, which are designed and fabricated on the simulation model, show good correlation with the simulation results.

J.  Electromagn. Waves Appl

A hybrid domain decomposition and optimization method for predicting electromagn


Published: Apr 04, 2015 by J. Electromagn. Waves Appl
Authors: F. P. Xiang, X. C. Wei, and E. P. Li
Subjects: Engineering - Electrical

Electromagnetic emission characterization of printed circuit boards (PCBs) based on phaseless near-field measurement is increasingly concerned. Generally, the PCB is modelled by equivalent elemental dipoles. To accurately model the PCB, enough dipoles are required and consequently an inevitable trade-off occurs between the modelling accuracy and the model retrieval efficiency. To deal with this issue, an efficient hybrid method is here proposed.

IEEE Trans. Electromagn. Compat.

PDN impedance modeling for multiple through vias array in doped silicon


Published: Apr 07, 2014 by IEEE Trans. Electromagn. Compat.
Authors: G. X. Luo, E. P. Li, X. C. Wei, X. Cui, and R. Hao
Subjects: Engineering - Electrical

The power distribution network (PDN) impedance of 3-D-through silicon vias (TSVs) interposer layer is modeled by considering the metal-oxide-semiconductor (MOS) structure effects. The PDN impedance characteristics of the 3-D-IC integrated system with multiple TSVs are performed by using the proposed multitransmission line and model reduction methods, and the importance of the capacitance is presented.

IEEE Trans. Electromagn. Compat.

Double-shielded interposer with highly doped layers for high-speed signal propag


Published: Mar 13, 2014 by IEEE Trans. Electromagn. Compat.
Authors: J. Li, X. C. Wei, X. J. Wang, H. C. Yu, D. C. Yang, R. Hao, and E. P. Li
Subjects: Engineering - Electrical

In this paper, we propose a novel double-shielded interposer design with two metal layers directly contacting to the silicon substrate surfaces for high-speed signal propagating along through silicon vias (TSVs). This is especially useful when the low-resistivity silicon is used for the interposer. Finally, some applied guidelines are proposed to strengthen the performance and simplify the silicon fabrication processes.

IEEE Trans. Electromagn. Compat.

A novel hybrid analytical method for impedance calculation of power and ground p


Published: Feb 06, 2013 by IEEE Trans. Electromagn. Compat.
Authors: D. C. Yang, X. C. Wei, X. C. Zhang, L. S. Zhang, and E. P. Li
Subjects: Engineering - Electrical

In this paper, a hybrid analytical method based on the Green's function is proposed to solve the noise propagation problem between the power and ground planes. This problem is equivalent to a 2-D transverse magnetic problem. A hybrid 2-D Green's function is derived. By the comparison with the full-wave method and measurement results, the accuracy and efficiency of the proposed hybrid method are validated.

IEEE Trans. Magnetics

Modeling of the simultaneous switching noise in high speed electronic circuit wi


Published: Apr 21, 2011 by IEEE Trans. Magnetics
Authors: G. P. Zou, X. C. Wei, E. P. Li, X. Cui, and W. D. Zhang
Subjects: Engineering - Electrical

. A new method for modeling SSN of power-ground planes with narrow slot is proposed in this paper. Firstly, the gapped power-ground planes characteristic is derived from a hybrid field-circuit method. Secondly, the vector fitting technique is used to approximate the transfer function as a rational function. Finally, the SSN voltage can be derived from this rational function and exciting current.

IEEE Trans. Microwave Theory Tech.

Extraction of equivalent network of arbitrarily shaped power-ground planes with


Published: Oct 07, 2010 by IEEE Trans. Microwave Theory Tech.
Authors: X. C. Wei, G. P. Zou, E. P. Li, and X. Cui
Subjects: Engineering - Electrical

A novel integral equation method for efficient and accurate modeling of power-ground planes with narrow slots is provided in this paper. By comparing the proposed method with measurement results and available full-wave methods, its accuracy and efficiency are verified.

IEEE Trans. Electromagn. Compat.

A novel combined equivalent networks analysis for power and ground planes with n


Published: Aug 30, 2010 by IEEE Trans. Electromagn. Compat.
Authors: X. C. Wei, Z. G. Shi, and E. P. Li
Subjects: Engineering - Electrical

To efficiently and accurately model resonance characteristics, we propose a novel combined equivalent networks method. By using the modal-decoupling technology, the whole gapped power and ground planes are decoupled into two subdomains: the power and ground planes, and the slots. After this, efficient integral equations are created on each subdomain. Finally, these two equivalent networks are connected together to consider the mode conversion between the parallel plate mode and slot mode.

IEEE Trans. Electromagn. Compat.

Progress review of electromagnetic compatibility analysis technologies for packa


Published: May 18, 2010 by IEEE Trans. Electromagn. Compat.
Authors: E. P. Li, X. C. Wei, A. C. Cangellaris, E. X. Liu, Y. J. Zhang, M. D’Amore, J. Kim, and T. Sudo
Subjects: Engineering - Electrical

This paper reviews the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies. It summarizes the modeling technologies for both available structures [multilayered power-ground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology). It also illustrates the trends of simulation and modeling technologies in EM compatibility, signal integrity, and power integrity.

IEEE Trans. Electromagn. Compat.

A new hybrid field-circuit approach to model the power-ground planes with narrow


Published: May 06, 2010 by IEEE Trans. Electromagn. Compat.
Authors: G. P. Zou, E. P. Li, X. C. Wei, G. X. Lou, and X. Cui
Subjects: Engineering - Electrical

In this paper, an equivalent circuit method is proposed to analyze the power and signal integrity of gapped power-ground (PG) planes. An integral-equation equivalent circuit method is used to model the arbitrarily shaped parallel-plane structure. Meanwhile, the transmission-line method is used to model the slot structure. Finally, the whole modeling of gapped PG planes can be obtained by integrating the aforementioned two equivalent networks.

IEEE Trans. Electromagn. Compat.

Systematic microwave network analysis for multilayer printed circuit boards with


Published: Mar 08, 2010 by IEEE Trans. Electromagn. Compat.
Authors: Y. J. Zhang, Z. Z. Oo, X. C. Wei, E. X. Liu, E. P. Li, and J. Fan
Subjects: Engineering - Electrical

An efficient microwave network method is proposed for signal and power integrity analysis of a multilayer printed circuit board with multiple vias and decoupling capacitors. Numerical simulations and measurements have been used to validate the method and good agreements have been observed. While the method is as accurate as full-wave numerical solvers, it achieves much higher efficiencies both in CPU time and memory requirements.

IEEE Trans. Microwave Theory Tech.

Integral-equation equivalent-circuit method for modeling of noise coupling in mu


Published: Feb 11, 2010 by IEEE Trans. Microwave Theory Tech.
Authors: X. C. Wei and E. P. Li
Subjects: Engineering - Electrical

We present the integral equation hybrid with the modal decoupling as a simple and efficient method for the modeling of multilayered power distribution networks. In this method, the power distribution network is decoupled into three simple parts: power-ground planes, signal traces, and multihole vias. The accuracy and efficiency of the proposed method are validated through comparison with the measurement and full-wave analysis.

 IEEE Trans. Electromagn. Compat.

Hybridization of the scattering matrix method and modal decomposition for analys


Published: Jun 23, 2009 by IEEE Trans. Electromagn. Compat.
Authors: Z. Z. Oo, E. P. Li, X. C. Wei, E. X. Liu, Y. J. Zhang, and L. W. Li
Subjects: Engineering - Electrical

A hybrid scattering matrix method (SMM) and a modal decomposition technique for analysis of signal traces in the power distribution network of an electronic package are presented in this paper. Numerical simulations are illustrated for coupling analysis of P-G vias to the signal traces in the package and examined through experimental and numerical validations.

IEEE Trans. Microwave Theory Tech.

Efficient simulation of power distribution network by using integral equation an


Published: Sep 23, 2008 by IEEE Trans. Microwave Theory Tech.
Authors: X. C. Wei, E. P. Li, E. X. Liu, and R. Vahldieck
Subjects: Engineering - Electrical

A novel integral-equation equivalent-circuit method is proposed for the efficient electrical simulation of the power distribution network in the electronic package and printed circuit board. The proposed method decomposes the complex 3-D problem into two simple 2-D problems, and then extracts the equivalent circuits. Therefore, it greatly reduces the computing time and memory requirement. Through several examples, its accuracy and efficiency are validated.

IEEE Trans. Adv. Packag.

Emission and susceptibility modeling of finite-size power-ground planes using a


Published: Aug 08, 2008 by IEEE Trans. Adv. Packag.
Authors: X. C. Wei, E. P. Li, E. X. Liu, E. K. Chua, Z. Z. Oo, and R. Vahldieck
Subjects: Engineering - Electrical

A novel method based on hybrid integral equation for electromagnetic emission and susceptibility modeling of power-ground planes with a finite size is proposed in this paper. This method can accurately simulate the impedance of the power-ground planes and the radiated field. In particular, it is able to predict the induced electric currents inside the power-ground planes that result from external interference sources.

IEEE Trans. Electromagn. Compat.

Efficient modeling of re-routed return currents in multilayered power-ground pla


Published: Aug 04, 2008 by IEEE Trans. Electromagn. Compat.
Authors: X. C. Wei, E. P. Li, E. X. Liu, and X. Cui
Subjects: Engineering - Electrical

In this paper, we propose an efficient integral equation equivalent network method to simulate the interference produced by the rerouted return currents of signal traces inside such PG planes. The integral equation is created based on the geometrical features of the PG planes. These [Z] matrices can be smoothly integrated with signal traces and other circuit models , so that the system-level signal integrity and power integrity can be simulated efficiently.

IEEE Trans. Electromagn. Compat.

Transmitting antenna’s reflected power and its influence on reverberation chambe


Published: Feb 20, 2007 by IEEE Trans. Electromagn. Compat.
Authors: X. C. Wei and E. P. Li
Subjects: Engineering - Electrical

In this paper, we analyzed the statistical property of this large reflected power. Furthermore, two different normalization methods used for chamber calibration are compared. However, from the view of the practical testing, the later one greatly reduces the testing complexity and is accurate enough for the engineering application

IEEE Trans. Electromagn. Compat.

Efficient EMC simulation of enclosures with apertures residing in an electricall


Published: Nov 01, 2005 by IEEE Trans. Electromagn. Compat.
Authors: X. C. Wei and E. P. Li
Subjects: Engineering - Electrical

The moment method coupled with the uniform theory of diffraction is employed in this paper to simulate the electromagnetic shielding performance of an enclosure with apertures residing in a very large platform, in which the moment method is used to accurately model the enclosure with apertures, and the influence of the large platform is efficiently calculated by using the uniform theory of diffraction.

IEEE Trans. Magn.

Efficient solution to the large scattering and radiation problem using the impro


Published: May 16, 2005 by IEEE Trans. Magn.
Authors: X. C. Wei, E. P. Li, and Y. J. Zhang
Subjects: Engineering - Electrical

In this paper, we use the multifrontal method to perform the triangular factorization of this ill-conditioned finite-element matrix. This improves the spectral property of the whole matrix and makes the hybrid method converge very fast. Through some numerical examples, including the scattering from a real-life aircraft model, the accuracy and efficiency of this improved hybrid method are demonstrated.

IEEE Trans. Antennas Propagat.

The hybridization of fast multipole method with asymptotic waveform evaluation f


Published: Apr 05, 2004 by IEEE Trans. Antennas Propagat.
Authors: X. C. Wei, Y. J. Zhang, and E. P. Li
Subjects: Engineering - Electrical

The fast multipole method hybridized with the asymptotic waveform evaluation is presented in this paper to efficiently calculate the scattering from electrically large objects. A novel interpolation method for the hybridization is proposed, which provides a more accurate result for the scattering pattern calculation than the original extrapolation method. The accuracy and efficiency of this proposed hybrid method are examined through numerical examples.

IEEE Trans. Electromagn. Compat.

Wide-band EMC analysis of on-platform antennas using impedance matrix interpolat


Published: Aug 26, 2003 by IEEE Trans. Electromagn. Compat.
Authors: X. C. Wei and E. P. Li
Subjects: Engineering - Electrical

An efficient method for the broadband EMC analysis of on-platform antennas is proposed, where the hybrid moment method-physical optics (MM-PO) formula is employed to generate the impedance matrix. The impedance matrix is calculated at relatively large frequency intervals and interpolated to approximate its values at intermediate frequencies. Numerical examples, including the coupling and radiation pattern evaluation of on-platform antennas, are presented.

IEEE Microw. Wireless Compon. Lett.

A new MRTD scheme based on Coifman scaling functions for the solution of scatter


Published: Dec 10, 2002 by IEEE Microw. Wireless Compon. Lett.
Authors: X. C. Wei, E. P. Li, and C. H. Liang
Subjects: Engineering - Electrical

This letter describes a new multiresolution time-domain scheme which is developed based on Coifman compactly supported scaling functions with a number of vanishing moments. The highly linear dispersion properties of this scheme are investigated and two-dimensional and three-dimensional scattering problems are analyzed in order to demonstrate the advantages of this scheme over conventional finite difference time-domain schemes with respect to memory requirements and computing time.

IEE Proc.-Sci. Meas. Technol.

Wavelet method in the solution of magnetic field integral equation


Published: Jun 03, 2002 by IEE Proc.-Sci. Meas. Technol.
Authors: X. C. Wei, E. P. Li, and C. H. Liang
Subjects: Engineering - Electrical

The wavelet method is applied for the solution of magnetic field integral equations, where the impedance matrix arising in the solution is sparsified and divided into four submatrices, and then the induced current is obtained by the iteration method. It is shown by numerical experiments that the computing time of this method is dramatically reduced compared to conventional methods, such as the method of moments hybridised with physical optics in radar cross-section computation.