Ceramic Interconnect Technology Handbook: 1st Edition (Hardback) book cover

Ceramic Interconnect Technology Handbook

1st Edition

Edited by Fred D. Barlow, III, Aicha Elshabini

CRC Press

456 pages | 277 B/W Illus.

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Hardback: 9780849335570
pub: 2007-01-24
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Description

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies.

Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates.

Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

Table of Contents

OVERVIEW OF CERAMIC INTERCONNECT TECHNOLOGY; Aicha Elshabini, Gangqiang Wang, and Dan Amey

Ceramics in Electronic Packaging

Electrical Properties of Ceramic Substrates

Mechanical and Physical Properties of Ceramic Substrates

Design Rules

Thick Films on Ceramics

Thin Films on Ceramics

High-Current Substrates

Applications

References

ELECTRICAL DESIGN, SIMULATION, AND TESTING; Daniel I. Amey and Kuldeep Saxena

Introduction

Electrical Properties

Electrical Design Considerations

Electrical and Thermal Design Considerations

Testing and Characterization

Summary

References

THERMOMECHANICAL DESIGN; Al Krum

Introduction

Fundamentals of Heat Transfer

Thermal Design

Techniques for Lowering Thermal Resistance

Mechanical Design Considerations

Thermal and Mechanical Simulation Tools

Thermal and Mechanical Measurements

References

CERAMIC MATERIALS; Jerry E. Sergent

Introduction

Substrate Manufacturing

Surface Properties of Ceramics

Thermal Properties of Ceramic Materials

Mechanical Properties of Ceramic Substrates

Electrical Properties of Ceramics

Processing of HTCC Substrates

Processing of LTCC Substrates

Applications

References

SCREEN PRINTING; Jerry E. Sergent

Introduction

The Screen

The Stencil

The Paste

Critical Parameters of the Paste

The Squeegee

The Printing Process

Screen Printer Setup and Operation

Screen Printer Setup

Geometric Effects on Print Thickness

Measurement of Print Thickness

Printing Considerations and Problems

Inspecting Printed Films

Glossary of Terms

References

MULTILAYER CERAMICS; Fred Barlow, Aicha Elshabini, and Arne K. Knudsen

Introduction

The Multilayer Ceramic Process

Design Considerations

Cofired Materials

Future Trends

References

PHOTO-DEFINED AND PHOTO-IMAGED FILMS; William J. Nebe and Terry R. Suess

Introduction

Photo-Imaged Ceramic Processes

PhotoPolymerization

Photo-Formed Ceramic Compositions, Developed Using Organic Solvents

Aqueous Developable Formulation

Photocurable Conductive Pastes: Background

Other Applications of Photocurable Paste Technology

Acknowledgements

References

COPPER INTERCONNECTS FOR CERAMIC SUBSTRATES AND PACKAGES; Al Krum

Introduction: Why Use Copper?

Electrical Performance

Thermal and Mechanical Properties of Copper

Direct Bond Copper (DBC)

Active Metal Brazing (AMB)

Thick-Film Copper

Thin Film

Plated Copper

References

INTEGRATED PASSIVES IN CERAMIC SUBSTRATES; Heiko Thust and Jens Müller

Introduction

Materials and Technologies for Lumped Elements

Design of Lumped Elements

Trimming of Lumped Elements

Lumped-Element Properties

LTCC-Integrated Passive Devices

Distributed Elements

References

INDEX

Subject Categories

BISAC Subject Codes/Headings:
TEC008000
TECHNOLOGY & ENGINEERING / Electronics / General
TEC008070
TECHNOLOGY & ENGINEERING / Electronics / Microelectronics
TEC021000
TECHNOLOGY & ENGINEERING / Material Science