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1st Edition

Ceramic Interconnect Technology Handbook




ISBN 9780849335570
Published January 24, 2007 by CRC Press
456 Pages - 277 B/W Illustrations

 
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Book Description

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies.

Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates.

Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

Table of Contents

OVERVIEW OF CERAMIC INTERCONNECT TECHNOLOGY; Aicha Elshabini, Gangqiang Wang, and Dan Amey
Ceramics in Electronic Packaging
Electrical Properties of Ceramic Substrates
Mechanical and Physical Properties of Ceramic Substrates
Design Rules
Thick Films on Ceramics
Thin Films on Ceramics
High-Current Substrates
Applications
References
ELECTRICAL DESIGN, SIMULATION, AND TESTING; Daniel I. Amey and Kuldeep Saxena
Introduction
Electrical Properties
Electrical Design Considerations
Electrical and Thermal Design Considerations
Testing and Characterization
Summary
References
THERMOMECHANICAL DESIGN; Al Krum
Introduction
Fundamentals of Heat Transfer
Thermal Design
Techniques for Lowering Thermal Resistance
Mechanical Design Considerations
Thermal and Mechanical Simulation Tools
Thermal and Mechanical Measurements
References
CERAMIC MATERIALS; Jerry E. Sergent
Introduction
Substrate Manufacturing
Surface Properties of Ceramics
Thermal Properties of Ceramic Materials
Mechanical Properties of Ceramic Substrates
Electrical Properties of Ceramics
Processing of HTCC Substrates
Processing of LTCC Substrates
Applications
References
SCREEN PRINTING; Jerry E. Sergent
Introduction
The Screen
The Stencil
The Paste
Critical Parameters of the Paste
The Squeegee
The Printing Process
Screen Printer Setup and Operation
Screen Printer Setup
Geometric Effects on Print Thickness
Measurement of Print Thickness
Printing Considerations and Problems
Inspecting Printed Films
Glossary of Terms
References
MULTILAYER CERAMICS; Fred Barlow, Aicha Elshabini, and Arne K. Knudsen
Introduction
The Multilayer Ceramic Process
Design Considerations
Cofired Materials
Future Trends
References
PHOTO-DEFINED AND PHOTO-IMAGED FILMS; William J. Nebe and Terry R. Suess
Introduction
Photo-Imaged Ceramic Processes
PhotoPolymerization
Photo-Formed Ceramic Compositions, Developed Using Organic Solvents
Aqueous Developable Formulation
Photocurable Conductive Pastes: Background
Other Applications of Photocurable Paste Technology
Acknowledgements
References
COPPER INTERCONNECTS FOR CERAMIC SUBSTRATES AND PACKAGES; Al Krum
Introduction: Why Use Copper?
Electrical Performance
Thermal and Mechanical Properties of Copper
Direct Bond Copper (DBC)
Active Metal Brazing (AMB)
Thick-Film Copper
Thin Film
Plated Copper
References
INTEGRATED PASSIVES IN CERAMIC SUBSTRATES; Heiko Thust and Jens Müller
Introduction
Materials and Technologies for Lumped Elements
Design of Lumped Elements
Trimming of Lumped Elements
Lumped-Element Properties
LTCC-Integrated Passive Devices
Distributed Elements
References
INDEX

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