Advanced Routing of Electronic Modules
By Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan
December 18, 1998
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits ...
By Michael Pecht, Yeun Tsun Wong
October 23, 1995
The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next ...