Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
    Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

  • interconnections
  • printed circuit boards
  • substrates
  • encapsulants
  • dielectrics
  • die attach materials
  • electrical contacts
  • thermal materials
  • solders
    Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
  • Introduction
    Properties of Electronics Packaging Materials
    Electrical Properties
    Thermal and Thermomechanical Properties
    Mechanical Properties
    Chemical Properties
    Miscellaneous Properties
    Zeroth-Level Packaging Materials
    Attachment Materials
    First-Level Packaging Materials
    Wire Interconnects
    Tape Interconnects
    Case Materials
    Lid Seals
    Second-Level Packaging Materials
    Reinforcement Fiber Materials
    Constraining Cores
    Flexible Wiring Board Materials
    Conductor Metals in Laminates
    Conformal Coatings
    Third-Level Packaging Materials
    Backpanel Materials
    Connectors Materials
    Cables and Flex Circuit Materials


    Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan