Electronic Packaging Materials and Their Properties: 1st Edition (Hardback) book cover

Electronic Packaging Materials and Their Properties

1st Edition

By Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

CRC Press

128 pages

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Hardback: 9780849396250
pub: 1998-12-18
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pub: 2017-12-19
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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.

Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

  • interconnections

  • printed circuit boards

  • substrates

  • encapsulants

  • dielectrics

  • die attach materials

  • electrical contacts

  • thermal materials

  • solders

    Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

  • Table of Contents


    Properties of Electronics Packaging Materials

    Electrical Properties

    Thermal and Thermomechanical Properties

    Mechanical Properties

    Chemical Properties

    Miscellaneous Properties

    Zeroth-Level Packaging Materials


    Attachment Materials


    First-Level Packaging Materials

    Wire Interconnects

    Tape Interconnects

    Case Materials

    Lid Seals


    Second-Level Packaging Materials

    Reinforcement Fiber Materials



    Constraining Cores

    Flexible Wiring Board Materials

    Conductor Metals in Laminates

    Conformal Coatings

    Third-Level Packaging Materials

    Backpanel Materials

    Connectors Materials

    Cables and Flex Circuit Materials




    About the Series

    Electronic Packaging

    Learn more…

    Subject Categories

    BISAC Subject Codes/Headings:
    TECHNOLOGY & ENGINEERING / Electronics / General
    TECHNOLOGY & ENGINEERING / Material Science