1st Edition
Electronic Packaging Materials and Their Properties
By Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan
Copyright 1998
120 Pages
by
CRC Press
128 Pages
by
CRC Press
Also available as eBook on:
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.... Read more
Introduction
Properties of Electronics Packaging Materials
Electrical Properties
Thermal and Thermomechanical Properties
Mechanical Properties
Chemical Properties
Miscellaneous Properties
Zeroth-Level Packaging Materials
Semiconductors
Attachment Materials
Substrates
First-Level Packaging Materials
Wire Interconnects
Tape Interconnects
Case Materials
Lid Seals
Leads
Second-Level Packaging Materials
Reinforcement Fiber Materials
Resins
Laminates
Constraining Cores
Flexible Wiring Board Materials
Conductor Metals in Laminates
Conformal Coatings
Third-Level Packaging Materials
Backpanel Materials
Connectors Materials
Cables and Flex Circuit Materials
Summary
Appendices
Index
Properties of Electronics Packaging Materials
Electrical Properties
Thermal and Thermomechanical Properties
Mechanical Properties
Chemical Properties
Miscellaneous Properties
Zeroth-Level Packaging Materials
Semiconductors
Attachment Materials
Substrates
First-Level Packaging Materials
Wire Interconnects
Tape Interconnects
Case Materials
Lid Seals
Leads
Second-Level Packaging Materials
Reinforcement Fiber Materials
Resins
Laminates
Constraining Cores
Flexible Wiring Board Materials
Conductor Metals in Laminates
Conformal Coatings
Third-Level Packaging Materials
Backpanel Materials
Connectors Materials
Cables and Flex Circuit Materials
Summary
Appendices
Index
Biography
Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan
