1st Edition

Handbook of Lapping and Polishing

Edited By Ioan D. Marinescu, Eckart Uhlmann, Toshiro Doi Copyright 2006
    508 Pages 378 B/W Illustrations
    by CRC Press

    Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice.

    Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry.

    Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.

    INTRODUCTION; Ioan Marinescu
    From Craft to Science
    Importance of the Abrasive
    Problem Solving
    References

    FUNDAMENTALS OF LAPPING; Eckart Uhlmann
    General Considerations
    Historical Development of Lapping
    Definition of Lapping and Classification of Lapping Processes
    Process Mechanisms and Subsurface Damage in Lapping
    Lapping Process as a Removal System
    Tool Specification
    Machine Settings
    Fundamentals of Planetary Kinematics
    Process Models and Simulation
    Symbols and Abbreviations
    References

    LAPPING OF DUCTILE MATERIALS; Ioan Marinescu, Ion Benea, and Naga Jyothi Sanku
    Introduction
    Physics of the Process
    Mechanism of the Process
    References
    Bibliography

    LAPPING OF BRITTLE MATERIALS; Ioan Marinescu, Ion Benea, and Mariana Pruteanu
    Introduction
    Background Information
    Nontraditional Lapping Processes
    ELID-Lap Grinding
    Materials, Experimental Setup, and Testing Procedure (Study Case)
    Experimental Results and Discussion
    References
    Bibliography
    Appendix A
    Appendix B

    LAPPING AND LAPPING MACHINES; Toshiro K. Doi and Daizo Ichikawa
    Introduction
    Processing Principles of Lapping and Its Characteristics
    Lapping Machine
    Both-Sides Simultaneous Lapping Machine Equipped with a New Micromotion Mechanism
    Conclusions

    POLISHING TECHNOLOGY; Toshiro K. Doi
    Polishing Principles
    Processing Accuracy and Damaged Layer
    Polishing Machines
    Mechanochemical Polishing and Chemical Mechanical Polishing
    Noncontact Polishing
    Magnetoabrasive Finishing
    Polishing Process Applying Electrophoretic Deposition
    Electroabrasive Mirror Polishing Process
    P-MAC Polishing
    Colloidal Silica Polishing
    References

    CHEMICAL MECHANICAL POLISHING AND ITS APPLICATIONS IN ULSI PROCESS; Toshiro K. Doi
    Orientations and Role of CMP in Semiconductor Process
    Basic Concept of Planarization CMP
    Basic Technology of Planarization CMP
    The Study Case of Device Wafer
    Thin Film Magnetic Recording Heads
    CMP of Compound Semiconductor Wafers
    References
    INDEX

    Biography

    Marinescu, Ioan D.; Uhlmann, Eckart; Doi, Toshiro