Handbook of Lapping and Polishing: 1st Edition (Hardback) book cover

Handbook of Lapping and Polishing

1st Edition

Edited by Ioan D. Marinescu, Eckart Uhlmann, Toshiro Doi

CRC Press

512 pages | 378 B/W Illus.

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Hardback: 9781574446708
pub: 2006-11-20
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pub: 2006-11-20
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Description

Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice.

Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry.

Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.

Table of Contents

INTRODUCTION; Ioan Marinescu

From Craft to Science

Importance of the Abrasive

Problem Solving

References

FUNDAMENTALS OF LAPPING; Eckart Uhlmann

General Considerations

Historical Development of Lapping

Definition of Lapping and Classification of Lapping Processes

Process Mechanisms and Subsurface Damage in Lapping

Lapping Process as a Removal System

Tool Specification

Machine Settings

Fundamentals of Planetary Kinematics

Process Models and Simulation

Symbols and Abbreviations

References

LAPPING OF DUCTILE MATERIALS; Ioan Marinescu, Ion Benea, and Naga Jyothi Sanku

Introduction

Physics of the Process

Mechanism of the Process

References

Bibliography

LAPPING OF BRITTLE MATERIALS; Ioan Marinescu, Ion Benea, and Mariana Pruteanu

Introduction

Background Information

Nontraditional Lapping Processes

ELID-Lap Grinding

Materials, Experimental Setup, and Testing Procedure (Study Case)

Experimental Results and Discussion

References

Bibliography

Appendix A

Appendix B

LAPPING AND LAPPING MACHINES; Toshiro K. Doi and Daizo Ichikawa

Introduction

Processing Principles of Lapping and Its Characteristics

Lapping Machine

Both-Sides Simultaneous Lapping Machine Equipped with a New Micromotion Mechanism

Conclusions

POLISHING TECHNOLOGY; Toshiro K. Doi

Polishing Principles

Processing Accuracy and Damaged Layer

Polishing Machines

Mechanochemical Polishing and Chemical Mechanical Polishing

Noncontact Polishing

Magnetoabrasive Finishing

Polishing Process Applying Electrophoretic Deposition

Electroabrasive Mirror Polishing Process

P-MAC Polishing

Colloidal Silica Polishing

References

CHEMICAL MECHANICAL POLISHING AND ITS APPLICATIONS IN ULSI PROCESS; Toshiro K. Doi

Orientations and Role of CMP in Semiconductor Process

Basic Concept of Planarization CMP

Basic Technology of Planarization CMP

The Study Case of Device Wafer

Thin Film Magnetic Recording Heads

CMP of Compound Semiconductor Wafers

References

INDEX

About the Series

Manufacturing Engineering and Materials Processing

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Subject Categories

BISAC Subject Codes/Headings:
TEC009070
TECHNOLOGY & ENGINEERING / Mechanical
TEC020000
TECHNOLOGY & ENGINEERING / Manufacturing
TEC021000
TECHNOLOGY & ENGINEERING / Material Science